Hot stamping decal resist

Details Hot stamping decal resist Hot stamping decal resist

1989-08-03

1991-01-08

Simmons, David

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

1566591, 156660, H01L 21312, B44C 1165

Patent

active

049832468

ABSTRACT:
This present invention is directed to a new technique for supplying and applying resist to copper and other substrate material. In accordance with the present invention, a hot stamping resist decal comprises a release sheet bearing a pattern of the dried residue of a resist. The resist comprises an ester of a styrene/maleic anhydride copolymer, a particulate filler, and a solvent. Advantageously, a plasticizer is included in the resist formulation and the particulate filler preferably includes a clay. The method of manufacturing the inventive hot stamping resist decal and for hot stamping the decal on a circuit board form additional aspects of the present invention.

REFERENCES:
patent: 4294641 (1981-10-01), Reed et al.
patent: 4421814 (1983-12-01), Piazza
patent: 4725524 (1988-02-01), Elzer et al.

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