Hot pressed and sintered sputtering target assemblies and method

Details Hot pressed and sintered sputtering target assemblies and method Hot pressed and sintered sputtering target assemblies and method

1996-10-11

1999-01-26

Ryan, Patrick

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

228194, 228208, 419 8, B23K 2000, C23C 1434

Patent

active

058633987

ABSTRACT:
Described is a hot pressed and sintered sputtering target assembly formed of hot pressed and sintered metal powder diffusion bonded together and to a backing plate by use of an intermediate adhesion layer of titanium or titanium alloy.

REFERENCES:
patent: 2940163 (1960-06-01), Davies
patent: 3657801 (1972-04-01), Hershenson
patent: 4468313 (1984-08-01), Okumura et al.
patent: 4610774 (1986-09-01), Sakata et al.
patent: 4752335 (1988-06-01), Korb
patent: 4820397 (1989-04-01), Fielder et al.
patent: 4826584 (1989-05-01), dos Santos Pereiro Ribeiro
patent: 4838935 (1989-06-01), Dunlop et al.
patent: 4889772 (1989-12-01), Bergmann et al.
patent: 4961831 (1990-10-01), Bergmann et al.
patent: 4961832 (1990-10-01), Shagun et al.
patent: 4963239 (1990-10-01), Shimamura et al.
patent: 4963240 (1990-10-01), Fukasawa et al.
patent: 4964962 (1990-10-01), Nobutani et al.
patent: 4964968 (1990-10-01), Arita
patent: 4964969 (1990-10-01), Kusakabe et al.
patent: 4966676 (1990-10-01), Fukasawa et al.
patent: 4966677 (1990-10-01), Aichert et al.
patent: 4971674 (1990-11-01), Hata
patent: 5066381 (1991-11-01), Ohta et al.
patent: 5230459 (1993-07-01), Mueller et al.
patent: 5282943 (1994-02-01), Lannutti et al.
patent: 5397050 (1995-03-01), Mueller
patent: 5522535 (1996-06-01), Ivanov et al.
patent: 5693203 (1997-12-01), Ohhashi et al.
John Dunlop et al., "Effects of Ti-W Target Processing Methods on Defect Generation During VLSI Device Fabrication", American Vacuum Society 37th Annual Symposium and Topical Conferences, Toronto, Canada, Oct. 8-12, 1990, 17 pages.

Affiliated with

Also associated with

Rating

Hot pressed and sintered sputtering target assemblies and method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Hot pressed and sintered sputtering target assemblies and method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Hot pressed and sintered sputtering target assemblies and method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1447018