Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – Automatic and/or material-triggered control
Patent
1993-03-29
1996-03-05
Drodge, Joseph W.
Adhesive bonding and miscellaneous chemical manufacture
Surface bonding means and/or assembly means therefor
Automatic and/or material-triggered control
100 50, 100 93P, 156382, 15658391, 425407, B29C 4358
Patent
active
054964334
ABSTRACT:
A hot press for producing a multilayered substrate including vertically opposing upper and lower bolsters relatively movable toward each other to press multilayered substrate blanks and to cool the plates after the bonding. A sealing arrangement includes a cylinder and encloses the upper and lower bolsters so as to define a hermetically sealed space, with an evacuating arrangement reducing the pressure inside the hermetically sealed space during heating and pressing in which a bonding agent in the multilayered substrate blanks is softened. A high-pressure gas supplying arrangement supplies a pressurizing gas into the hermetically sealed space so as to impart the bonding pressure. A pressure sensor detects the pressure inside the hermetically sealed space, and a controller effects a compensation for incremental increases in the bonding pressure when the pressure inside the hermetically sealed space is reduced by the evacuating arrangement and for incrementally decreasing the bonding pressure when the pressure inside the space is elevated by the pressurized gas, by feedback output signals of the pressure sensor to the hydraulic pressure source.
REFERENCES:
patent: 3953053 (1976-01-01), Armstrong
patent: 4367115 (1983-01-01), Bohn et al.
patent: 4666551 (1987-05-01), Soberay et al.
patent: 4828472 (1989-05-01), Itoh et al.
patent: 4857135 (1989-08-01), Copp
patent: 4963221 (1990-10-01), Isobe et al.
patent: 5182121 (1993-01-01), Miyashita et al.
Fujii Mutsumasa
Kogawa Kiyonori
Kyoui Masayuki
Miyashita Akimi
Drodge Joseph W.
Hitachi Techno Engineering Co. Ltd.
LandOfFree
Hot press for use in production of multilayered substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Hot press for use in production of multilayered substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Hot press for use in production of multilayered substrate will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1410419