Hot press for producing multilayer circuit board

Details Hot press for producing multilayer circuit board Hot press for producing multilayer circuit board

1994-06-09

1996-11-26

Simmons, David A.

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

Automatic and/or material-triggered control

156359, 1565831, 1565833, 100 48, 100 51, 100 93P, B32B 3100

Patent

active

055781594

ABSTRACT:
In a hot press according to the present invention, a control panel detects the fact that the viscosity of bonding resin of multilayer circuit board materials is minimized by taking thereinto at least one of the values measured by a speed sensor of a lower bolster, a measuring portion for measuring a control current of an electromagnetic proportional relief valve and a relief amount detector for detecting the relief amount of the electromagnetic proportional relief valve, and gives an instruction of an optimum air pressure addition timing. Accordingly, even if the multilayer circuit board materials and the like are varied, it is always possible to change over from a vacuum condition to an air pressure added condition at the best timing, thereby making it possible to obtain a multilayer circuit board of a uniform thickness without causing generation of void.

REFERENCES:
patent: 3925139 (1975-12-01), Simmons
patent: 3935053 (1976-01-01), Armstrong, Jr.
patent: 3979248 (1976-09-01), Kussmaul
patent: 4264394 (1981-04-01), Izumihara
patent: 4367115 (1983-01-01), Bohn et al.
patent: 4806195 (1989-02-01), Namysl
patent: 4986870 (1991-01-01), Frohlich

Affiliated with

Also associated with

Rating

Hot press for producing multilayer circuit board does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Hot press for producing multilayer circuit board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Hot press for producing multilayer circuit board will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1970246