Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – Presses or press platen structures – per se
Patent
1984-04-16
1985-12-10
Wityshyn, Michael
Adhesive bonding and miscellaneous chemical manufacture
Surface bonding means and/or assembly means therefor
Presses or press platen structures, per se
100 93P, 100258A, 100270, 100918, 15658391, B30B 1534
Patent
active
045577927
ABSTRACT:
A hot press capable of minimizing a displacement of one substrate from another in multilayer printed circuit boards each constituted by a plurality of substrates having wiring pattern groups printed thereon which are pressed together by applying pressure into a multilayer printed circuit board. The end is attained by minimizing a variation in thickness from a central portion of the board to a peripheral portion thereof. The hot press includes plate thickness adjusting devices each interposed between each bolster and each heat insulating member to compress and deform the heat insulating members beforehand. By imparting a deformation beforehand to each heat insulating member, contacting surfaces of the heat insulating members become substantially planer when they are compressed as pressure is applied to the substrates to press them together into a multilayer printed circuit board, thereby minimizing the variation in thickness from one portion to another in the multilayer printed circuit board produced by the hot press.
REFERENCES:
patent: 3914975 (1975-10-01), Kawano
patent: 4113909 (1978-09-01), Beasley
patent: 4423674 (1984-01-01), Thies
Miyashita Akimi
Murooka Hideyasu
Ono Kaoru
Yamada Osamu
Hitachi , Ltd.
Wityshyn Michael
LandOfFree
Hot press does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Hot press, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Hot press will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-57310