Electric heating – Heating devices – Combined with container – enclosure – or support for material...
Reexamination Certificate
2005-11-22
2005-11-22
Paik, Sang (Department: 3742)
Electric heating
Heating devices
Combined with container, enclosure, or support for material...
C219S541000
Reexamination Certificate
active
06967313
ABSTRACT:
An object to provide a hot plate making it possible to heat an object to be heated uniformly, and the hot plate of the present invention is characterized in that a resistance element having a thickness dispersion of ±3 μm or less is formed on an insulating substrate.
REFERENCES:
patent: 3579722 (1971-05-01), Fennimore et al.
patent: 3883719 (1975-05-01), Hurko
patent: 4574292 (1986-03-01), Takikawa et al.
patent: 4804823 (1989-02-01), Okuda et al.
patent: 5118983 (1992-06-01), Morita et al.
patent: 5151871 (1992-09-01), Matsumura et al.
patent: 5442239 (1995-08-01), DiGiacomo et al.
patent: 5554839 (1996-09-01), Tsuruta et al.
patent: 5560851 (1996-10-01), Thimm et al.
patent: 5643483 (1997-07-01), Kubota et al.
patent: 6080970 (2000-06-01), Yoshida et al.
patent: 6133557 (2000-10-01), Kawanabe et al.
patent: 6465763 (2002-10-01), Ito et al.
patent: 6475606 (2002-11-01), Niwa
patent: 6507006 (2003-01-01), Hiramatsu et al.
patent: 2002/0043527 (2002-04-01), Ito
patent: 2002/0055021 (2002-05-01), Niwa
patent: 2003/0015521 (2003-01-01), Ito
patent: 2004/0035846 (2004-02-01), Hiramatsu et al.
patent: 2004/0149723 (2004-08-01), Furukawa et al.
patent: 56-88319 (1981-07-01), None
patent: 59-165395 (1984-09-01), None
patent: 61-10893 (1986-01-01), None
patent: 62-167396 (1987-10-01), None
patent: 1315903 (1989-12-01), None
patent: 3-182087 (1991-08-01), None
patent: 9-139278 (1997-05-01), None
patent: 11-40330 (1999-02-01), None
patent: 11-251040 (1999-09-01), None
U.S. Appl. No. 09/673,953, filed Dec. 21, 2000, Ito et al.
U.S. Appl. No. 09/806,477, filed Jun. 25, 2001, Ito et al.
U.S. Appl. No. 10/346,095, filed Jan. 17, 2003, Ito et al.
U.S. Appl. No. 10/048,490, filed Apr. 30, 2002, Ito et al.
U.S. Appl. No. 09/524,010, filed Mar. 13, 2000, Niwa.
U.S. Appl. No. 09/946,463, filed Sep. 6, 2001, Niwa.
U.S. Appl. No. 10/244,008, filed Sep. 16, 2002, Niwa.
U.S. Appl. No. 10/670,354, filed Sep. 26, 2003, Niwa.
U.S. Appl. No. 10/168,527, filed Jun. 28, 2002, Hiramatsu et al.
U.S. Appl. No. 09/831,887, filed May 23, 2001, Ito et al.
U.S. Appl. No. 10/387,452, filed Mar. 14, 2003, Ito et al.
U.S. Appl. No. 10/069,943, filed Jul. 10, 2002, Ito et al.
U.S. Appl. No. 10/732,296, filed Dec. 11, 2003, Ito et al.
U.S. Appl. No. 10/277,818, filed Oct. 23, 2002, Hiramatsu et al.
U.S. Appl. No. 09/807,960, filed May 18, 2001, Hiramatsu et al.
U.S. Appl. No. 10/229,177, filed Aug. 28, 2002, Hiramatsu et al.
U.S. Appl. No. 10/049,293, filed Apr. 30, 2002, Ito et al.
U.S. Appl. No. 10/226,160, filed Aug. 23, 2002, Ito et al.
U.S. Appl. No. 09/806,478, filed Jul. 26, 2001, Ito et al.
U.S. Appl. No. 09/926,092, filed Dec. 27, 2001, Ito et al.
U.S. Appl. No. 10/618,651, filed Jul. 15, 2003, Ito et al.
U.S. Appl. No. 10/618,623, filed Jul. 15, 2003, Ito et al.
U.S. Appl. No. 10/618,655, filed Jul. 15, 2003, Ito et al.
U.S. Appl. No. 10/618,665, Jul. 15, 2003, Ito et al.
U.S. Appl. No. 09/869,321, Oct. 18, 2001, Zhou.
U.S. Appl. No. 09/926,012, Oct. 24, 2001, Hiramatsu et al.
U.S. Appl. No. 10/352,138, Jan. 28, 2003, Hiramatsu et al.
U.S. Appl. No. 10/260,360, Oct. 1, 2002, Niwa.
U.S. Appl. No. 09/926,297, filed Dec. 26, 2001, Hiramatsu et al.
U.S. Appl. No. 10/746,081, Dec. 29, 2003, Hiramatsu et al.
U.S. Appl. No. 09/926,296, Dec. 27, 2001, Ito et al.
U.S. Appl. No. 09/926,362, Jan. 16, 2002, Hiramatsu et al.
U.S. Appl. No. 10/442,967, filed May 22, 2003, Hiramatsu et al.
U.S. Appl. No. 09/926,464, Jan. 10, 2002, Hiramatsu et al.
U.S. Appl. No. 09/926,499, filed Mar. 26, 2002, Hiramatsu et al.
U.S. Appl. No. 10/386,615, Mar. 13, 2003, Hiramatsu et al.
U.S. Appl. No. 10/088,100, Jun. 26, 2002, Ido.
U.S. Appl. No. 09/926,714, filed Dec. 6, 2001, Ito et al.
U.S. Appl. No. 10/009,174, filed Apr. 21, 2003, Hiramatsu et al.
U.S. Appl. No. 09/926,713, Mar. 5, 2002, Hiramatsu.
U.S. Appl. No. 10/619,567, Jul. 16, 2003, Hiramatsu et al.
U.S. Appl. No. 09/926,800, filed Mar. 19, 2002, Hiramatsu et al.
U.S. Appl. No. 10/615,950, filed Jul. 10, 2003, Hiramatsu et al.
U.S. Appl. No. 10/311,368, Dec. 16, 2002, Ito et al.
U.S. Appl. No. 10/416,497, May 19, 2003, Hiramatsu et al.
U.S. Appl. No. 10/019,280, Apr. 22, 2002, Ito et al.
U.S. Appl. No. 10/697,287, Oct. 31, 2003, Ito et al.
U.S. Appl. No. 10/019,448, Apr. 8, 2002, Ito et al.
U.S. Appl. No. 10/019,444, Apr. 23, 2002, Hiramatsu et al.
U.S. Appl. No. 10/019,311, Apr. 9, 2002, Hiramatsu et al.
U.S. Appl. No. 10/397,321, Mar. 27, 2003, Hiramatsu et al.
U.S. Appl. No. 10/030,123, May 16, 2002, Hiramatsu et al.
U.S. Appl. No. 10/718,535, Nov. 24, 2003, Hiramatsu et al.
U.S. Appl. No. 10/343,747, Feb. 6, 2003, Ito et al.
U.S. Appl. No. 10/048,979, Apr. 26, 2002, Hiramatsu et al.
U.S. Appl. No. 10/048,989, May 29, 2002, Hiramatsu et al.
U.S. Appl. No. 10/069,511, Jun. 24, 2002, Ito et al.
U.S. Appl. No. 10/069,510, Jun. 20, 2002, Hiramatsu et al.
U.S. Appl. No. 10/070,443, Jun. 24, 2002, Hiramatsu et al.
U.S. Appl. No. 10/070,441, Jun. 26, 2002, Ito et al.
U.S. Appl. No. 10/088,098, May 30, 2002, Ito et al.
U.S. Appl. No. 10/362,941, Apr. 28, 2003, Ito.
U.S. Appl. No. 10/111,980, Apr. 30, 2002, Ito et al.
U.S. Appl. No. 10/181,724, Jul. 22, 2002, Hiramatsu et al.
U.S. Appl. No. 10/343,833, Feb. 10, 2003, Zhou et al.
U.S. Appl. No. 10/344,148, Feb. 10, 2003, Kariya et al.
U.S. Appl. No. 10/398,393, Apr. 7, 2003, Hiramatsu et al.
U.S. Appl. No. 10/473,585, Oct 9, 2003, Ito.
U.S. Appl. No. 10/363,310, filed Mar. 3, 2003, Ito.
U.S. Appl. No. 10/432,639, filed Jun. 10, 2003, Ito et al.
U.S. Appl. No. 09/462,067, filed Jan. 5, 2001, Furukawa et al.
U.S. Appl. No. 09/471,759, filed Dec. 23, 1999, Saito et al.
U.S. Appl. No. 09/787,816, filed Mar. 23, 2001, Ito.
U.S. Appl. No. 09/917,749, filed Jul. 31, 2001, Ito.
U.S. Appl. No. 09/787,954, filed Mar. 23, 2001, Ito.
U.S. Appl. No. 10/345,356, filed Jan. 16, 2003, Ito.
U.S. Appl. No. 09/787,818, filed Mar. 23, 2001, Ito.
U.S. Appl. No. 09/915,418, filed Jul. 27, 2001, Ito.
U.S. Appl. No. 10/356,519, filed Feb. 3, 2003, Ito.
U.S. Appl. No. 10/217,029, filed Aug. 13, 2002, Ito.
U.S. Appl. No. 09/979,676, filed Nov. 5, 2001, Zhou.
U.S. Appl. No. 10/049,539, filed Nov. 7, 2001, Zhou.
U.S. Appl. No. 10/048,894, filed Feb. 1, 2002, Furukawa.
U.S. Appl. No. 09/806,957, filed Apr. 6, 2001, Ito et al.
U.S. Appl. No. 09/890,358, filed Jul. 30, 2001, Ito.
U.S. Appl. No. 09/916,682, filed Jul. 30, 2001, Ito.
U.S. Appl. No. 10/222,928, filed Aug. 19, 2002, Ito.
U.S. Appl. No. 10/182,009, filed Jul. 24, 2002, Zhou.
U.S. Appl. No. 09/958,689, filed Oct. 10, 2001, Furukawa et al.
U.S. Appl. No. 09/926,730, filed Apr. 16, 2001, Hiramatsu et al.
U.S. Appl. No. 10/265,413, filed Oct. 7, 2002, Ohashi et al.
U.S. Appl. No. 09/880,742, filed Jun. 13, 2001, Saito et al.
U.S. Appl. No. 09/880,359, filed Jun. 13, 2001, Saito et al.
U.S. Appl. No. 09/880,379, filed Jun. 13, 2001, Saito et al.
U.S. Appl. No. 09/926,465, filed Feb. 12, 2002, Furukawa et al.
U.S. Appl. No. 10/766,027, filed Jan. 29, 2004, Ito et al.
U.S. Appl. No. 10/876,665, filed Jun. 28, 2004, Ito et al.
U.S. Appl. No. 10/901,109, filed Jul. 29, 2004, Hiramatsu et al.
U.S. Appl. No. 10/900,113, filed Jul. 28, 2004, Hiramatsu et al.
U.S. Appl. No. 10/943,974, filed Sep. 20, 2004, Ito et al.
U.S. Appl. No. 10/928,146, filed Aug. 30, 2004, Hiramatsu et al.
U.S. Appl. No. 10/921,992, filed Aug. 20, 2004, Hiramatsu et al.
U.S. Appl. No. 10/842,482, filed May 11, 2004, Zhou.
U.S. Appl. No. 10/858,044, filed Jun. 2, 2004, Hiramatsu et al.
U.S. Appl. No. 10/916,405, filed Aug. 12, 2004, Hiramatsu et al.
U.S. Appl. No. 10/918,351, filed Aug. 16, 2004, Ito et al.
U.S. Appl. No. 10/921,271, filed Aug. 19, 2004, Hiramatsu.
Furukawa Masakazu
Ido Yoshiyuki
Ibiden Company, Ltd.
Paik Sang
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