Hot melt pressure sensitive adhesive designed for use on high de

Details Hot melt pressure sensitive adhesive designed for use on high de Hot melt pressure sensitive adhesive designed for use on high de

1997-03-28

1999-02-09

Szekely, Peter A.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

At least one aryl ring which is part of a fused or bridged...

524271, 524274, 524499, 525 88, 525 98, 525 99, C08L 5302, C08L 5702, C08L 9304

Patent

active

058695621

ABSTRACT:
This invention relates to an envelope coated with a hot melt pressure sensitive adhesive composition preferably comprising a) from about 10% to about 40% by weight in the adhesive of at least one block copolymer selected from the group consisting of styrene-isoprene-styrene block copolymers, styrene-butadiene-styrene block copolymers and mixtures thereof wherein the block copolymers comprise from about 15% to about 35% styrene by weight in the copolymer and diblock contents from about 0% to about 90% by weight in the copolymer; and b) from about 60% to about 90% by weight in the adhesive of a modifier selected from the group consisting of solid tackifying resins, liquid tackifying resins, liquid elastomers and mixtures thereof. The invention further relates to an improved oil-free pressure sensitive adhesive that is low in viscosity and provides a destructive bond and resists deformation of high density spun polyolefin materials.

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