Plastic and nonmetallic article shaping or treating: processes – Mechanical shaping or molding to form or reform shaped article – To produce composite – plural part or multilayered article
Patent
1994-05-31
1995-10-24
Ball, Michael W.
Plastic and nonmetallic article shaping or treating: processes
Mechanical shaping or molding to form or reform shaped article
To produce composite, plural part or multilayered article
26427217, 264279, 264261, 156155, 156292, 15624412, 15624422, 29841, 427 96, 427284, 427264, 427270, B29C 6552, B29C 6540, B29C 3910, B29C 3912
Patent
active
054607671
ABSTRACT:
A method is provided for processing an electronic circuit assembly having surface mount integrated circuit packages mounted to its substrate, in which ingress of a conformal coating into a void present between the IC package and the substrate is prevented by a masking composition which forms a barrier around the IC package prior to the conformal coating process. The masking compositions are hot melt materials, in that each is initially a solid at roughly room temperature, melts to become a liquid at an elevated temperature at which the masking composition is applied to the electronic assembly, and forms a solid upon cooling to a temperature corresponding to a service temperature of the electronic assembly. As such, the masking compositions can be rapidly applied through various highly controllable techniques, and will quickly and sufficiently solidify upon cooling to allow handling of the electronic assembly. The masking compositions may be nonreactive, indicating that the barrier can be remelted, or reactive, indicating that a post-application curing process occurs over time at a temperature less than the elevated application temperature.
REFERENCES:
patent: 4278707 (1981-07-01), Biran
patent: 5232758 (1993-08-01), Juskey et al.
patent: 5246730 (1993-09-01), Peirce et al.
patent: 5266349 (1993-11-01), Bok
Rosson James M.
Sanftleben Henry M.
Ball Michael W.
Delco Electronics Corporation
Lorin Francis J.
Navarre Mark A.
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