Hot melt conformal coating materials

Details Hot melt conformal coating materials Hot melt conformal coating materials

1994-05-24

1996-04-23

Beck, Shrive

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

4273855, 427386, 427387, 4273981, 427421, 427422, B05D 512

Patent

active

055101380

ABSTRACT:
Conformal coating materials are provided for forming a protective conformal coating on the surface of an electronic assembly. The conformal coating materials are characterized by being hot melt materials, in that they are each initially a solid or semisolid at approximately room temperature, a liquid at an elevated temperature at which the coating material is applied to the electronic assembly, and solidify upon cooling to a temperature corresponding to a service temperature of the electronic assembly. As such, the coating systems can be rapidly applied through various highly controllable techniques associated with hot melt dispensing equipment. In addition, the coating systems quickly solidify upon cooling to allow handling of the electronic assembly. The conformal coating systems may be nonreactive, indicating that the system can be remelted, or reactive, indicating that a post-application curing process occurs over time at a temperature less than the elevated application temperature.

REFERENCES:
patent: 4572853 (1986-02-01), Ikeya et al.
patent: 5302671 (1994-04-01), Cifuentes et al.
patent: 5352491 (1994-10-01), Cifuentes et al.

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