Hot melt adhesives with excellent heat resistance

Stock material or miscellaneous articles – Web or sheet containing structurally defined element or... – Adhesive outermost layer

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428355AC, 524272, 524275, 524277, 524487, 524489, 524502, 524514, 524515, 524523, C09J 702

Patent

active

059287829

ABSTRACT:
A hot melt useful for packaging, comprising from about 10% to about 30% by weight of at least one copolymer of ethylene and methyl acrylate (both acrylates and methacrylates); from about 10% to about 20% by weight of at least one copolymer of ethylene and n-butyl acrylate (both acrylates and methacrylates), wherein the total polymer content does not exceed 40% by weight, and the total ethylene n-butyl acrylate copolymer content does not exceed the total ethylene methyl acrylate copolymer content by percent weight in the adhesive; from about 20% to about 60% by weight of at least one tackifying resin selected from the group consisting of rosins and modified rosins and hydrogenated derivatives; aliphatic, cycloaliphatic and aromatic hydrocarbon resins and modified hydrocarbon resins and hydrogenated derivatives; terpenes and modified terpenes and hydrogenated derivatives; and mixtures thereof; from about 5% to about 30% by weight of at least one wax; and up to about 2% by weight of an antioxidant; wherein the resultant adhesive has peel values greater than about 150.degree. F. (about 65.degree. C.).

REFERENCES:
patent: 4816306 (1989-03-01), Brady et al.
patent: 4874804 (1989-10-01), Brady et al.
patent: 5331033 (1994-07-01), Stauffer et al.
patent: 5500472 (1996-03-01), Liedermooy et al.

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