Hot-melt adhesives based on polyamide-block graft copolymers

Details Hot-melt adhesives based on polyamide-block graft copolymers Hot-melt adhesives based on polyamide-block graft copolymers

2005-01-25

2005-01-25

Woodward, Ana (Department: 1711)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

At least one aryl ring which is part of a fused or bridged...

C525S054400, C525S063000, C525S069000, C525S179000

Reexamination Certificate

active

06846874

ABSTRACT:
The present invention relates to a hot-melt adhesive composition comprising:20 to 80% of a blend comprising: 50 to 100% of (A), which denotes a polyamide-block graft copolymer consisting of a polyolefin backbone and at least one polyamide graft, 0 to 50% of at least one polymer (B) chosen from polyolefins and polyamides;80 to 20% of a blend comprising at least one tackifying resin and optionally at least one product chosen from waxes, plasticizers and mineral fillers; in which:the said graft is attached to the backbone via the residues of an unsaturated monomer (X) chosen from unsaturated carboxylic acids, anhydrides of unsaturated carboxylic acids and unsaturated epoxides;the residues of the unsaturated monomer (X) are attached to the backbone by grafting or copolymerization from its double bond;the molar mass {overscore (M)}nof the grafts is between 1000 and 5000;the melting point of the grafts is between 100 and 190° C.; andthe MFI of (A) is between 1 and 500 (g/10 mm at 190° C. under a load of 2.16 kg).

REFERENCES:
patent: 5342886 (1994-08-01), Glotin et al.
patent: 5843577 (1998-12-01), Ouhadi et al.
patent: 6310127 (2001-10-01), Jablon
patent: 00 09607 (2000-02-01), None
patent: 00 58403 (2000-10-01), None

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