Hot melt adhesives based on ethylene-n-butyl acrylate

Details Hot melt adhesives based on ethylene-n-butyl acrylate Hot melt adhesives based on ethylene-n-butyl acrylate

1987-06-19

1989-03-28

Lesmes, George F.

Stock material or miscellaneous articles

Hollow or container type article

Polymer or resin containing

229 48T, 428348, 524275, 524487, B65D 500

Patent

active

048163066

ABSTRACT:
Hot melt packaging adhesive compositions consisting essentially of 35 to 45% by weight of an ethylene n-butyl acrylate copolymer containing 25-45% by weight, preferably 30 to 40% n-butyl acrylate and having a melt index of at least 50; 35 to 55% of a terpene phenolic tackifier; and 10 to 20% by weight of a high melting synthetic wax provide adhesives characterized by an excellent balance of high and low temperature performance without sacrifice to machinability or thermal stability.

REFERENCES:
patent: 3884786 (1975-05-01), Domine et al.
patent: 4146521 (1979-03-01), Godfrey
patent: 4167433 (1979-09-01), Lakshmanan
patent: 4404299 (1983-09-01), Decroix
patent: 4434261 (1984-02-01), Brugel et al.
patent: 4471086 (1984-09-01), Foster
patent: 4500661 (1985-02-01), Lakshmanan
patent: 4631308 (1986-12-01), Graham et al.

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