Hot melt adhesive system having centralized manifold and...

Details Hot melt adhesive system having centralized manifold and... Hot melt adhesive system having centralized manifold and...

2005-04-26

2005-04-26

Nicolas, Frederick (Department: 3754)

Dispensing

With heating or cooling means

Heating only

C222S146500, C222S330000

Reexamination Certificate

active

06883684

ABSTRACT:
A dispensing unit for a hot melt adhesive system has a manifold centrally located within the dispensing unit to permit commonality between heated hoses of substantially the same length used to supply adhesive guns at either side of the dispensing unit. The dispensing unit also includes a manifold that is thermally isolated from the adhesive tank. The manifold has a heater that is independent of the tank heater for more precise temperature control of adhesive flowing through the manifold. A pump coupled to the manifold is located external to the tank and is heated by the manifold heater.

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patent: 0107077 (1984-02-01), None

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