Stock material or miscellaneous articles – Web or sheet containing structurally defined element or... – Adhesive outermost layer
Reexamination Certificate
1998-05-21
2001-05-15
Morris, Terrel (Department: 1771)
Stock material or miscellaneous articles
Web or sheet containing structurally defined element or...
Adhesive outermost layer
C428S343000
Reexamination Certificate
active
06231974
ABSTRACT:
FIELD OF THE INVENTION
This invention relates to hot-melt adhesive sheets and semiconductor devices. More particularly, this invention relates to a hot-melt adhesive sheet that provides very precise bonding and exhibits a stress-relaxation capacity. It also relates to highly reliable semiconductor devices in which the semiconductor element therein is bonded to its element attachment site using this hot-melt adhesive sheet.
BACKGROUND OF THE INVENTION
Hot-melt adhesives—which have the capacity to bond various substrates once the adhesive has been softened by heating—also find use as adhesives for bonding semiconductor elements to the corresponding element attachment sites. For example, Japanese Patent Application Laid Open (Kokai or Unexamined) Number Sho 61-201432 (201,432/1986) teaches a method in which a hot-melt adhesive is first coated on an integrated circuit-bearing silicon wafer and the semiconductor elements cut from that wafer are then bonded to their attachment sites.
However, since hot-melt adhesives employ a heat softening regimen, their use to bond a semiconductor element to its attachment site has been associated with the problem of an inability to achieve highly precise bonding due to outflow of the adhesive into the area surrounding the element and variations in the thickness of the adhesive. Moreover, hot-melt adhesives have had a poor stress-relaxation capacity under challenge by thermal shock, which has resulted in a reduced device reliability for semiconductor devices containing a semiconductor element that has been bonded to its attachment site by a hot-melt adhesive.
SUMMARY OF THE INVENTION
The inventors achieved the present invention as a result of extensive research directed to solving the problems described above.
In specific terms, an object of the present invention is to provide a hot-melt adhesive sheet that provides very precise bonding and exhibits a stress-relaxation capacity.
Another object of the present invention is to provide highly reliable semiconductor devices in which the semiconductor element therein is bonded to its element attachment site using this hot-melt adhesive sheet.
The hot-melt adhesive sheet according to the present invention characteristically has hot-melt adhesive on both surfaces of the sheet and has a spacer within the sheet.
Semiconductor devices according to the present invention are characterized in that the semiconductor element therein is bonded to its element attachment site by the hot-melt adhesive sheet described above.
REFERENCES:
patent: 4624724 (1986-11-01), Davis
patent: 5523137 (1996-06-01), Sei
patent: 5538771 (1996-07-01), Nakayama
patent: 5614316 (1997-03-01), Hashimoto
patent: 5707730 (1998-01-01), Oishi
patent: 5976698 (1999-11-01), Staral
patent: 61/201432 (1986-09-01), None
Isshiki Minoru
Mine Katsutoshi
Otani Yoshiko
Yamakawa Kimio
Dow Corning Toray Silicone Company, Ltd.
Milco Larry A.
Morris Terrel
Ruddock Ula C.
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