Hot melt adhesive of ethylene/unsaturated acid copolymer and epo

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Processes of preparing a desired or intentional composition...

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Details

523207, 523463, 523465, 525119, 525936, C08K 501, C08K 910, C08L 2308

Patent

active

050950460

ABSTRACT:
A heat curable hot melt adhesive system is disclosed. The system uses an epoxy-crosslinking ethylene polymer component, a tackifier compatible therewith and an epoxy crosslinking agent having an epoxide functionality of at least 2. The ethylene polymer component may be either an ethylene copolymer of an .alpha.,.beta.-ethylenically unsaturated carboxylic acid, or an ethylene copolymer of an ethylenically unsaturated alcohol used in combination with a dicarboxylic acid anhydride. The dicarboxylic acid anhydride and/or the epoxy can be encapsulated to inhibit premature crosslinking. The formulation is applied to a substrate surface as a hot melt at a moderate temperature, and subsequently cured by heating the adhesive composition to a higher curing temperature.

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