Hot-melt adhesive of epoxy resins and amino groups-containing po

Details Hot-melt adhesive of epoxy resins and amino groups-containing po Hot-melt adhesive of epoxy resins and amino groups-containing po

1989-08-07

1992-01-28

Marquis, Melvyn I.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

523428, C08L 6302

Patent

active

050845322

ABSTRACT:
A reactive hot-melt adhesive is described, which contains a resin component, at least one thermally activatable latent curing agent for the resin component and optionally accelerators, fillers, thixotropic agents and further conventional additives. The adhesive is characterized in that the resin component is obtainable by reacting a) an epoxy resin solid at room temperature and b) an epoxy resin liquid at room temperature with c) a linear polyoxypropylene having amino terminal groups, in which the epoxy resins a) and b) are used in such a quantity, based on the polyoxypropylene with amino terminal groups, that an excess of epoxy groups, based on the amino groups, is ensured.

REFERENCES:
patent: 4403078 (1983-09-01), McCoy et al.
patent: 4423170 (1983-12-01), Waddill
patent: 4514530 (1985-06-01), Sellstrom
patent: 4552933 (1985-11-01), Sellstrom et al.
patent: 4578412 (1986-08-01), Sellstrom
patent: 4661541 (1987-02-01), Batzill
patent: 4707232 (1987-03-01), Batzill
patent: 4728384 (1988-03-01), Goel
patent: 4734468 (1988-03-01), Marx
patent: 4912179 (1990-03-01), Murakami et al.
Abstract of Japanese Patent No. 61-207425 published Sep. 13, 1986.

Affiliated with

Also associated with

Rating

Hot-melt adhesive of epoxy resins and amino groups-containing po does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Hot-melt adhesive of epoxy resins and amino groups-containing po, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Hot-melt adhesive of epoxy resins and amino groups-containing po will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1861706