Hot-melt adhesive in particulate form

Details Hot-melt adhesive in particulate form Hot-melt adhesive in particulate form

2007-09-11

2007-09-11

Kiliman, Leszek (Department: 1773)

Stock material or miscellaneous articles

Composite

Of polyamidoester

C428S423500, C428S423700, C428S424600, C156S331700, C156S332000, C427S208200

Reexamination Certificate

active

10703341

ABSTRACT:
A moisture-curing hot-melt-adhesive composition in granulate, tablet or powder form can be produced bya.) fusing the reactive hot-melt-adhesive composition and heating the melt, subject to exclusion of moisture,b.) extruding this melt through one or more dies onto a cooled surface, subject to exclusion of moisture,c.) cooling the granulate, subject to exclusion of moisture, whereby the composition solidifies,d.) removing the cooled hot-melt-adhesive granulate,e.) filling the granulate into moisture-tight packages, subject to exclusion of moisture.These reactive hot-melt adhesives are pourable and free-flowing and therefore can be used with all conventional application machines for hot-melt adhesives.

REFERENCES:
patent: 4384083 (1983-05-01), Baker
patent: RE32325 (1987-01-01), Smith
patent: 5472785 (1995-12-01), Stobbie, IV et al.
patent: 5710215 (1998-01-01), Abend
patent: 5776406 (1998-07-01), Schubert et al.
patent: 5869555 (1999-02-01), Simmons et al.
patent: 5906704 (1999-05-01), Matsuura et al.
patent: 5942569 (1999-08-01), Simmons et al.
patent: 6613865 (2003-09-01), Magunia et al.
patent: 6716527 (2004-04-01), Czmok et al.
patent: 2 392 960 (2001-06-01), None
patent: 280 540 (1990-07-01), None
patent: 44 46 027 (1996-07-01), None
patent: 199 52 089 (2001-04-01), None
patent: 195 41 923 (2001-07-01), None
patent: 0 832 953 (1998-04-01), None
patent: 11-228833 (1999-08-01), None
patent: WO93/25599 (1993-12-01), None
patent: WO 00/47687 (2000-08-01), None
patent: WO 01/27188 (2001-04-01), None
patent: WO 01/40342 (2001-06-01), None
Database WPI Section CH, Week 199944, Derwent Publications Ltd., London, GB; AN 1999-522892, XP002214075 of JP 11-228833 (Aug. 24, 1999).
Huber et al., “Shaping Reactive Hot Melts Using LMW Copolyesters”,Adhesives Age, pp. 32-35 (1987).
Kleben & Dichten, “Kapazitive Fullstands-uberwachung an Granulat-Behaltern”,Adhasion, pp. 26-28 (2001).
G. Habenicht, “Kleben, Grunlagen, Technologie, Anwendungen”, 2ndEdition, Chapter 2.7.6, pp. 68-70 (1990).
“Shore A and Shore D hardness testing of rubber”, DIN 53 505, Beuth Verlag GmbH, Berlin Germany, pp. 1-5 (2000).
Huber et al., Leitlinien fur die Formulierung von reaktiven Schmelzkebstoffen, 11, Munchener Klebstoff-und Veredelungsseminar, pp. 1-20 (1986).
“Standard Test Methods for Softening Point of Resins Derived from Navel Stores by Rings and Ball Apparatus”, ASTM E 28, pp. 1-6 (2000).

Affiliated with

Also associated with

Rating

Hot-melt adhesive in particulate form does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Hot-melt adhesive in particulate form, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Hot-melt adhesive in particulate form will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3735427