Hot melt adhesive having controllable water solubility

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – At least one aryl ring which is part of a fused or bridged...

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

524612, 525 92A, 428346, 428355CN, 428344, C08L 5300, C08L10104, B32B 712

Patent

active

060341688

ABSTRACT:
A water sensitive hot melt adhesive composition based on polyalkyleneimine copolymers for use with articles such as paper products, disposable nonwoven products, tapes, labels and packaging materials. By varying the amount of copolymer included in the composition as well as by varying the chain structure and the ratio of soluble versus insoluble repeating units in the copolymer, an adhesive may be formulated to modify the degree of solubility from 100% to 0% soluble in water and/or other performance characteristics. The adhesive composition includes about 10% to about 70%, by weight, of a polyalkyleneimine copolymer or a blend of one or more polyalkyleneimine copolymers; about 0% to about 70%, by weight, of a tackifying resin; about 10% to about 70%, by weight, of a compatible plasticizer; and about 0.1% to about 3% by weight of one or more antioxidant. The adhesive maintains the article in an assembled condition by providing adequate adhesive bond strength during normal use, but dissolves in the presence of water thereby permitting the article to be recycled or otherwise disposed of in an environmentally friendly manner.

REFERENCES:
patent: 4052368 (1977-10-01), Larson
patent: 4172824 (1979-10-01), Harrington, Jr. et al.
patent: 4325851 (1982-04-01), Colon et al.
patent: 4331576 (1982-05-01), Colon et al.
patent: 4623688 (1986-11-01), Flanagan
patent: 4699941 (1987-10-01), Salerno
patent: 4871803 (1989-10-01), Zimmel et al.
patent: 5071914 (1991-12-01), Zimmel et al.
patent: 5143961 (1992-09-01), Scholl et al.
patent: 5459184 (1995-10-01), Bunnelle et al.
patent: 5543488 (1996-08-01), Miller et al.
patent: 5552511 (1996-09-01), Miller et al.
patent: 5605764 (1997-02-01), Miller et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Hot melt adhesive having controllable water solubility does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Hot melt adhesive having controllable water solubility, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Hot melt adhesive having controllable water solubility will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-363979

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.