Thermal measuring and testing – Temperature measurement – In spaced noncontact relationship to specimen
Reexamination Certificate
2006-07-04
2006-07-04
Gutierrez, Diego (Department: 2859)
Thermal measuring and testing
Temperature measurement
In spaced noncontact relationship to specimen
C374S121000, C374S124000
Reexamination Certificate
active
07070325
ABSTRACT:
Hot melt adhesive sensing systems and methods including detecting (410) multiple areas of a target, for example, a hot adhesive material, by sensing changes in temperature with a corresponding number of thermal sensors, summing (420) an output of the thermal sensors, and evaluating (430) the summed output by comparing the summed output with a reference, the results of which may be assessed relative to a specified tolerance.
REFERENCES:
patent: 3100097 (1963-08-01), Woltersdorf
patent: 3462602 (1969-08-01), Apple
patent: 3539807 (1970-11-01), Bickel
patent: 3667846 (1972-06-01), Nater et al.
patent: 3861458 (1975-01-01), Ostrander et al.
patent: 4044250 (1977-08-01), Fetzer
patent: 4109508 (1978-08-01), Fukuyama
patent: 4122720 (1978-10-01), Podl
patent: 4215939 (1980-08-01), Miller
patent: 4458152 (1984-07-01), Bonora
patent: 4626389 (1986-12-01), Lempfer et al.
patent: 4704603 (1987-11-01), Edwards et al.
patent: 4831258 (1989-05-01), Paulk et al.
patent: 4967083 (1990-10-01), Kornbrekke et al.
patent: 5020473 (1991-06-01), Bergman
patent: 5186541 (1993-02-01), Paulk
patent: 5220169 (1993-06-01), Ninomiya et al.
patent: 5319202 (1994-06-01), Pompei
patent: 5323005 (1994-06-01), Merkel
patent: 5438233 (1995-08-01), Boland et al.
patent: 5444248 (1995-08-01), Ichien
patent: 5582663 (1996-12-01), Matsunaga
patent: 5663565 (1997-09-01), Taylor
patent: 5717485 (1998-02-01), Ito et al.
patent: 5839829 (1998-11-01), Litvin et al.
patent: 5894126 (1999-04-01), Pompei et al.
patent: 5915295 (1999-06-01), Lauderbaugh
patent: 6122420 (2000-09-01), Satoh
patent: 6196714 (2001-03-01), Bellifemine
patent: 6452180 (2002-09-01), Nistler et al.
patent: 6854496 (2005-02-01), Ishibuchi et al.
patent: 2002/0148567 (2002-10-01), Bett et al.
patent: 2002/0166970 (2002-11-01), Komulainen et al.
patent: 2003/0036047 (2003-02-01), Okubo
patent: 2004/0052297 (2004-03-01), McDonald et al.
patent: 2004/0083958 (2004-05-01), Saidman et al.
patent: 2004/0089811 (2004-05-01), Lewis et al.
patent: 2004/0252747 (2004-12-01), Garvelink et al.
patent: 4304343 (1994-08-01), None
patent: 19750862 (1998-06-01), None
patent: 0373332 (1988-10-01), None
patent: 0852333 (1998-07-01), None
patent: 906729 (1999-04-01), None
patent: 10101028 (1998-04-01), None
patent: 10119933 (1998-05-01), None
patent: 9401796 (1996-06-01), None
patent: 9634273 (1996-10-01), None
U.S. Appl. No. 09/542,776, filed Apr. 4, 2000, Bolger.
LQ-Series Laser Module, WSTech (Product Brochure) 1999, (1 page).
TH Series Sensor, SUNX Sensors USA, West Des Moines, IA (1 page).
Heerdt Dieter B.
Jenkins Paul M.
Breh Donald J.
Croll Mark W.
Gutierrez Diego
Illinois Tool Works Inc.
Jagan Mirellys
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