Hot-melt adhesive compositions

Details Hot-melt adhesive compositions Hot-melt adhesive compositions

1978-04-17

1979-04-10

Lieberman, Paul

Chemistry of carbon compounds

Miscellaneous organic carbon compounds

260 298, 260829, 260857R, C08K 536, C08L 7700

Patent

active

041487753

ABSTRACT:
A novel hot-melt adhesive composition comprising 100 parts by weight of a polyamide copolymer resin having a melting point of about 80.degree. to about 160.degree. C. and composed of at least three monomers, about 5 to about 30 parts by weight of a terpene-phenol resin having a softening point of about 80.degree. to about 120.degree. C., and about 5 to about 10 parts by weight of a plasticizer.

REFERENCES:
patent: 3437622 (1969-04-01), Dahl
patent: 3642686 (1972-02-01), Zwahlen
Chemical Abstracts, Uchigaki, Taku, et al., Japan Kokai 75 63,028, vol. 83 (1975) Abstract No. 180344K.

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