Hot melt adhesive composition that melts at relatively low tempe

Details Hot melt adhesive composition that melts at relatively low tempe Hot melt adhesive composition that melts at relatively low tempe

1990-11-19

1994-07-05

Gallagher, John J.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

51216LP, 51284R, 156155, 156305, 156327, 156344, 524277, 524487, B32B 3100

Patent

active

053264134

ABSTRACT:
Novel lower temperature hot melt adhesive and coating composition that melts at temperatures less than 190.degree. F. (about 87.8.degree. C). This composition has a sufficient modulus to bind ophthalmic lenses to metal blocks during grinding processes. The composition also exhibits low melt viscosity and may be mechanically removed without leaving significant residue. Composition comprises a resin, a tackifier, a wax (generally with a molecular weight less than 600), and an optional stabilizer.

REFERENCES:
patent: 3944695 (1976-03-01), Kosaka et al.
patent: 4235761 (1980-11-01), Koenig
patent: 4280939 (1981-07-01), Johnson
patent: 4404299 (1983-09-01), Decroix
patent: 5036129 (1991-07-01), Atwell et al.
patent: 5041482 (1991-08-01), Ornsteen et al.
Patent Cooperation Treaty International Search Report mailed Mar. 5, 1992.

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