Hot melt adhesive composition based on a random copolymer of...

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Mixing of two or more solid polymers; mixing of solid...

Reexamination Certificate

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C525S232000, C525S240000, C525S241000, C524S013000, C524S270000, C524S271000, C524S274000, C524S275000, C524S425000, C524S444000, C524S445000, C524S449000, C524S451000

Reexamination Certificate

active

07067585

ABSTRACT:
A hot melt adhesive composition is based on an isotactic polypropylene random copolymer (RCP). The composition contains about 4%–50% by weight of the RCP copolymer, about 20%–65% by weight of a compatible tackifier, about 0%–40% by weight of a plasticizer, about 0%–3% by weight of a stabilizer, about 0%–40% by weight of a wax, and optionally about 0%–60% by weight of an atactic poly-α-olefin (APAO). The adhesive composition may be used in a number of applications such as, for example, in disposable nonwoven hygienic articles, paper converting, flexible packaging, wood working, carton and case sealing, labeling and other assembly applications.

REFERENCES:
patent: 4022728 (1977-05-01), Trotter et al.
patent: 4120916 (1978-10-01), Meyer et al.
patent: 4330645 (1982-05-01), Juza et al.
patent: 4761450 (1988-08-01), Lakshmanan et al.
patent: 4857594 (1989-08-01), Lakshmanan et al.
patent: 5317070 (1994-05-01), Brant et al.
patent: 5476914 (1995-12-01), Ewen et al.
patent: 5478891 (1995-12-01), Lakshmanan et al.
patent: 5618895 (1997-04-01), Kerth et al.
patent: 5723546 (1998-03-01), Sustic
patent: 5747573 (1998-05-01), Ryan
patent: 5789502 (1998-08-01), Shamshoum et al.
patent: 5804519 (1998-09-01), Riswick et al.
patent: 6329468 (2001-12-01), Wang
patent: 6380292 (2002-04-01), Gibes et al.
patent: 6482281 (2002-11-01), Schmidt
patent: 6486246 (2002-11-01), Vion
patent: 6653385 (2003-11-01), Wang et al.
patent: 6664309 (2003-12-01), Svenningsen et al.
patent: 2002/0007033 (2002-01-01), Karandinos et al.
patent: 1344642 (2003-09-01), None
patent: WO 94/04625 (1994-03-01), None
patent: WO 01/46277 (2001-06-01), None
patent: WO 01/53408 (2001-07-01), None
patent: WO 01/81493 (2001-11-01), None
patent: WO 03/033612 (2003-04-01), None

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