Hot melt adhesive composition

Details Hot melt adhesive composition Hot melt adhesive composition

1988-08-23

1989-10-03

Short, Patricia

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

525163, 525185, 525186, 525282, 5253304, 5253305, 5253306, C08L 3104

Patent

active

048718114

ABSTRACT:
A hot melt adhesive composition comprising (A) 99 to 80 wt % of a thermoplastic resin selected from the group consisting of a substantially amorphous thermoplastic saturated polyester resin, an ethylene-vinyl acetate copolymer and an ethylene-ethyl acrylate copolymer and (B) from 1 to 20 wt % of a monofunctional or polyfunctional cyanate ester compound having at least one cyanato group in the molecule is disclosed. The hot melt adhesive composition can further contain a co-modifier, a monofunctional or polyfunctional maleimide compound or a cross-linking catalyst for the thermoplastic resin (A). This composition has improved adhesive force, mechanical characteristics and heat resistance.

REFERENCES:
patent: 4330669 (1982-05-01), Ikeguchi
patent: 4369304 (1983-01-01), Gaku
patent: 4370467 (1983-01-01), Gaku
patent: 4396745 (1983-08-01), Ikeguchi
patent: 4404330 (1983-09-01), Ikeguchi

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