Hot-melt adhesive and its use in polyimide film and printed circ

Details Hot-melt adhesive and its use in polyimide film and printed circ Hot-melt adhesive and its use in polyimide film and printed circ

1990-10-22

1993-05-18

Kight, III, John

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

From phenol, phenol ether, or inorganic phenolate

528125, 528128, 528170, 528171, 528172, 528173, 528174, 528176, 528179, 528185, 528188, 528220, 528226, 528229, 528310, 528331, 528332, 528350, 528351, 528352, 528353, 428458, 4284735, 428901, C08G 7310, C08G 6926, B32B 1508, B32B 2706

Patent

active

052122794

ABSTRACT:
A hot-melt adhesive comprising a special polyamideimide or polyamide is excellent in heat resistance and adhesive strength and usable for providing substrates for printed circuit boards.

REFERENCES:
patent: 4448957 (1984-05-01), Nagaoka
patent: 4847349 (1989-07-01), Ohta et al.
patent: 4861855 (1989-08-01), Bockrath et al.
patent: 4864008 (1989-09-01), Murata et al.
patent: 4880895 (1989-11-01), Higashi et al.
patent: 4883718 (1989-11-01), Ohta et al.
patent: 4908409 (1990-03-01), Oikawa et al.
patent: 4923968 (1990-05-01), Kunimune et al.
patent: 4954612 (1990-09-01), Nomura et al.
patent: 4970292 (1990-11-01), Bockrath et al.
patent: 4973661 (1990-11-01), Lee et al.
patent: 4977232 (1990-12-01), Maruyama et al.
CA 112(18):160076p.

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