Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Polymers from only ethylenic monomers or processes of...
Patent
1991-12-18
1993-09-14
Teskin, Fred
Synthetic resins or natural rubbers -- part of the class 520 ser
Synthetic resins
Polymers from only ethylenic monomers or processes of...
526346, 526125, 525241, 156334, 428461, 428483, 428513, 428523, 4285375, C09J12318, C09J12508, C08L 2318, B32B 1504
Patent
active
052449963
DESCRIPTION:
BRIEF SUMMARY
BACKGROUND OF THE INVENTION
Field of the Invention
The present invention relates to a hot-melt adhesive comprising a random copolymer of an .alpha.-olefin having 4 to 12 carbon atoms with an aromatic vinyl monomer. More particularly, the present invention relates to a hot-melt adhesive comprising a copolymer of an .alpha.-olefin having 4 to 12 carbon atoms with an aromatic vinyl monomer, which is excellent in adhesiveness, workability and environmental aging resistances such as thermal aging resistance, and can be used in various fields such as packaging, bookmaking, pouchmaking, woodworking, can manufacturing, construction and sanitary use.
The present invention also relates to a composition comprising the above-mentioned copolymer and a tackifier, which can be used as a hot-melt adhesive or a heat sealant.
Recently, the hot-melt adhesive has been increasingly used in various fields since it is superior to prior art solvent type adhesive in coating properties, safety, cleanness for working atmosphere and energy savings. Compositions including a base polymer such as natural rubber, ethylene-vinyl acetate copolymer, a styrene-butadiene-styrene block copolymer have been used as prior art hot-melt adhesives and heat-sealing adders.
However, since the compositions including a base polymer such as natural rubber, a styrene-butadiene-styrene block copolymer, a styrene-isoprene-styrene copolymer have a lot of double bonds, they are poor in thermal resistance stability and have problems that oxidation, decomposition and coloring do not only occurs on application, but also the bonding performance changes with time after bonding. An ethylene-vinyl acetate copolymer based composition has a poor adhesiveness to polyolefin resins such as polyethylene and polypropylene.
For the prior art hot-melt adhesive, it is generally necessary to compound a tackifier into a base polymer. A single-component resin for adhesive having both performances of the base polymer and the tackifier has been demanded for simplicity of steps and preventing variations of products on compounding.
SUMMARY OF THE INVENTION
The present inventors have found from the intensive study for providing a resin for adhesive which is excellent in adhesiveness, workability and environmental aging resistances such as thermal aging resistance that a random copolymer including a given .alpha.-olefin and an aromatic vinyl monomer is excellent in the aforementioned characteristics and have completed the present invention.
The present invention aims at overcoming the abovementioned problems which the prior art has encountered.
It is an object of the present invention to provide a hot-melt adhesive comprising an .alpha.-olefin aromatic vinyl monomer copolymer which is excellent in adhesiveness, workability and environmental aging resistance.
In accordance with the present invention, there is provided a hot-melt adhesive comprising a random copolymer of an .alpha.-olefin having 4 to 12 carbon atoms with an aromatic vinyl monomer, said .alpha.-olefin unit being contained in an amount of 50 to 98% by mol in the copolymer, said copolymer having a melting viscosity in the range of 1000 to 100,000 centipoise at 200.degree. C. and a softening point in the range of 40.degree. to 150.degree. C.
In accordance with the present invention, there is also provided a composition, comprising: an unit derived from an .alpha.-olefin having 4 to 12 carbon atoms and an unit derived from an aromatic vinyl monomer; 96% by mol; and decahydronaphthalene at 135.degree. C. being in the range of 0.01 to 7 dl/g;
DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS
In accordance with the present invention, by performing a random copolymerization between an .alpha.-olefin having 4 to 12 carbon atoms and an aromatic vinyl monomer by maintaining the content of the .alpha.-olefin in the range of 50 to 98% by mol, the softening point can be maintained in the range from 40.degree. to 150.degree. C. which is suitable for a hot-melt adhesive and the adhesive power to various substrates can be remarkabl
REFERENCES:
patent: 3644252 (1972-02-01), Shenfeld et al.
WPIL/Derwent Abstract of Japanese Laid-Open Patent Publication No. 04-001215 (Jan. 6, 1992).
WPI/Derwent Abstract of Japanese Laid-Open Patent Publication No. 52-081393 (Jul. 7, 1977).
Kawasaki Masaaki
Kitani Hiroaki
Minami Shuji
Yoshitake Junichi
Mitsui Petrochemical Industries Ltd.
Teskin Fred
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