Hot-melt adhesive

Details Hot-melt adhesive Hot-melt adhesive

2007-06-18

2008-10-21

Nutter, Nathan M (Department: 1796)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

C525S240000, C525S241000

Reexamination Certificate

active

07439305

ABSTRACT:
Hot-melt adhesives containing at least one aromatic modified polyethylene and/or polypropylene (co)polymer, a further ethylene or propylene/C4 to C20 alpha-olefin copolymer, and at least one tackifying resin are useful for the adhesive bonding of package and paperboard products.

REFERENCES:
patent: 4762878 (1988-08-01), Takeda et al.
patent: 4952639 (1990-08-01), Minomiya et al.
patent: 5530054 (1996-06-01), Tse et al.
patent: 5670566 (1997-09-01), Liedermooy et al.
patent: 5985074 (1999-11-01), Heemann et al.
patent: 6107430 (2000-08-01), Dubois et al.
patent: 6143846 (2000-11-01), Herrmann et al.
patent: 6872279 (2005-03-01), Kolowrot et al.
patent: 2007/0036945 (2007-02-01), Balakoff et al.
patent: 195 22 568 (1997-01-01), None
patent: 696 02 035 (1999-12-01), None
patent: 199 44 225 (2000-03-01), None
patent: 0 890 584 (2002-05-01), None
patent: WO 96/40830 (1996-12-01), None
patent: WO 00/00565 (2000-01-01), None

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