Hot melt adhesive

Chemistry of carbon compounds – Miscellaneous organic carbon compounds

Patent

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Details

260 306R, 260878R, 260888, C08L 9100

Patent

active

040254780

ABSTRACT:
A pressure sensitive hot melt adhesive formulation is provided that contains, as the sole adhesive component, a solid polybutadiene which has been produced from an unhydrogenated polybutadiene having a vinyl content of at least 50 percent and subsequently has been hydrogenated to a vinyl content of less than 15 percent. The hot melt adhesive formulation also contains a sufficient amount of a tackifier, preferably a hydrogenated rosin, to produce an adhesive formulation having a viscosity at 350.degree. F. of from about 1,500 to about 1 million, preferably about 15,000 to about 350,000 cps. The formulation can also contain up to 5 percent by weight of the total combination of the polybutadiene and tackifier of heat and light stabilizing compounds.

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