Metal fusion bonding – With means to remove – compact – or shape applied flux or filler
Patent
1987-11-24
1988-11-08
Godici, Nicholas P.
Metal fusion bonding
With means to remove, compact, or shape applied flux or filler
228 40, 228191, 228264, B23K 300, B23K 306, B23K 3706
Patent
active
047829915
ABSTRACT:
A solder reflow machine for removing and replacing electronic components of the pin-grid array type having a large number of leads soldered into a very densely populated printed circuit board. The machine utilizes a heat-transfer liquid and a vacuum to remove the component from the board. The printed circuit board is positioned with the component facing downwardly. A tank containing the heat-transfer liquid is located below the printed circuit board. The apparatus includes a solder reflow head which has a component-engaging vacuum plate with a central opening that is in communication with a vacuum source through a pipe which is pulled downwardly to remove the component. The component is surrounded by a wall in combination with the bottom of the printed circuit board and seals off the liquid flow path. The heat-transfer liquid is pumped up through a pipe that extends into a storage tank so that it flows into, an input passageway in the solder reflow head over the component leads to reflow the solder and down an exit passageway.
REFERENCES:
patent: 3684151 (1972-08-01), Burman et al.
patent: 3773261 (1973-11-01), Helton
patent: 4115601 (1978-09-01), Amman et al.
patent: 4187973 (1980-02-01), Fortune
patent: 4256512 (1981-03-01), Amman et al.
patent: 4426571 (1984-01-01), Beck
patent: 4518110 (1985-05-01), Breske et al.
patent: 4561584 (1985-12-01), Hug
patent: 4659002 (1987-04-01), Wallgren et al.
Kristiansen F., "Nozzle For Reflow Soldering," IBM Technical Disclosure Bulletin, vol. 11 No. 5, Oct. 1968, p. 482.
Vavoso G., "Removal of Soldered Components," IBM Technical Disclosure Bulletin, vol. 12 No. 12, May 1970, p. 2221.
Tickner C. R., "Chip Removal by Hot Gas," IBM Technical Disclosure Bulletin, vol. 11 No. 7, Dec. 1968, p. 875.
Trollman C., "Solder Reflow Tool," IBM Technical Disclosure Bulletin, vol. 11 No. 10, Mar. 1969, p. 1298.
Dingman E. G., "Solvent Vapor Solder Reflow," IBM Technical Disclosure Bulletin, vol. 13 No. 3, Aug. 1970, p. 639.
Bowen Glenn W.
Godici Nicholas P.
Heinrich Samuel M.
Marhoefer Laurence J.
Unisys Corporation
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