Metal fusion bonding – With means to juxtapose and bond plural workpieces
Patent
1992-01-16
1992-10-06
Ramsey, Kenneth J.
Metal fusion bonding
With means to juxtapose and bond plural workpieces
228 62, 239538, 239562, B23K 304
Patent
active
051524473
ABSTRACT:
A device for installing or removing a component with respect to a substrate utilizing hot gas jets or other hot gas flow to reflow solder associated with the component. The device includes an improved tip mounted with respect to a hot gas supply, the tip including (a) a manifold member having an inlet bore mountable with respect to the hot gas supply, and one or more manifolds connected to the inlet bore, each manifold having at least one opening in a side thereof, and (b) at least one nozzle member including a sleeve with an opening in the side thereof, and a hollow nozzle connected to the sleeve and having an opening at the distal end thereof, the sleeve being rotatably mountable on the manifold to effect selective engagement of the opening in the sleeve with the opening in the manifold so that, in a first rotated position of the sleeve with respect to the manifold, the opening in the manifold communicates with the opening in the sleeve to effect a hot gas jet passage from the hot gas supply to the nozzle opening via the inlet bore, the manifold, and the nozzle and, in a second rotated position of the sleeve with respect to the manifold, communication between the opening in the manifold and the opening in the sleeve is substantially blocked to thus prevent formation of the hot gas jet passage. A plurality of nozzle members may be provided on each manifold member such that the length of the jet may be adjusted. Moreover, two manifolds may be arranged in parallel to apply the hot jets to terminals at the opposite sides of a component or they may be orthogonally disposed with respect to each other to apply the jets to terminals at adjacent sides of the component. Furthermore, two of the tips having orthogonally disposed manifolds may be adjustably mounted with respect to each other to apply hot jets to four sides of a component.
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Karl Leister, Contactless de-soldering and soldering of SMD- and DIP-Components between 20.degree. and 600.degree. C. with the electronically controllable hot air stream of the Leister Hot-Jet, Leaflet 51C.
Siegel Eric S.
Wallgren Linus E.
Pace Incorporated
Ramsey Kenneth J.
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