Plastic article or earthenware shaping or treating: apparatus – Female mold and means to shape parison directly by internal...
Reexamination Certificate
2005-07-05
2005-07-05
Davis, Robert B. (Department: 1722)
Plastic article or earthenware shaping or treating: apparatus
Female mold and means to shape parison directly by internal...
C249S102000, C249S111000, C425S526000
Reexamination Certificate
active
06913455
ABSTRACT:
A hot fill hot fill mold assembly has two mold half shells and two mold half carriers for supporting the mold half shells. The shells each have an inner wall that defines the shape of at least a portion of the container to be formed. Each shell has outer wall surface portions and a plurality of spaced apart slotted grooves extending between the outer wall surface portions that define open air spaces recessed from the outer wall portions. The mold half carriers have a carrier inner wall that overlays in contacting and thermal conducting relation the outer wall surface portions of a corresponding one of the mold half shells and overlays the spaced apart slotted grooves to create thermal buffering open air pockets between the mold half shells and the mold half carriers so as to reduce the thermal conduction away from the mold face and improve hot fill container formation.
REFERENCES:
patent: 3380121 (1968-04-01), Chittenden et al.
patent: 3768948 (1973-10-01), Horberg et al.
patent: 3861640 (1975-01-01), Agneta
patent: 3978910 (1976-09-01), Gladwin
patent: 4032278 (1977-06-01), Kuenzig et al.
patent: 4151976 (1979-05-01), Schurman
patent: RE30215 (1980-02-01), Kuenzig et al.
patent: 4330248 (1982-05-01), Platte
patent: 4476170 (1984-10-01), Jabarin
patent: 4699585 (1987-10-01), Giese et al.
patent: 4815960 (1989-03-01), Rudolph
patent: 4822543 (1989-04-01), Iizuka et al.
patent: 4863046 (1989-09-01), Collette et al.
patent: 4884961 (1989-12-01), Iizuka et al.
patent: 4927680 (1990-05-01), Collette et al.
patent: 5217729 (1993-06-01), Terauchi et al.
patent: 5255889 (1993-10-01), Collette et al.
patent: 5411699 (1995-05-01), Collette et al.
patent: 5571474 (1996-11-01), Przytulla
patent: 5766299 (1998-06-01), Miller
patent: 5968560 (1999-10-01), Briere et al.
patent: 6113377 (2000-09-01), Clark
patent: 6428302 (2002-08-01), Tsau
patent: 6444159 (2002-09-01), Petre
patent: 6447281 (2002-09-01), Petre
patent: 2082350 (1995-11-01), None
patent: 2313881 (2002-01-01), None
patent: 2 240 300 (1991-07-01), None
patent: 63-202425 (1988-08-01), None
Kyi Kyi San
Nitsche Reinhold Ernst
Tsau Tar
Davis Robert B.
Wentworth Mold Inc.
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