Hot dipping lead base coating material

Details Hot dipping lead base coating material Hot dipping lead base coating material

1980-08-18

1982-04-06

Roy, Upendra

Specialized metallurgical processes, compositions for use therei

Processes

Free metal or alloy reductant contains magnesium

75166B, 75166D, C23B 514, C23B 538, C23B 540

Patent

active

043233937

ABSTRACT:
A lead base coating material containing 0.3-30.0 weight percent, preferably 3.0-4.9 weight percent of tin and 0.001-0.3 weight percent, preferably 0.001-0.02 weight percent in phosphorus content equivalent of at least one selected from the group consisting of phosphorus, tin phosphide, zinc phosphide, antimony phosphide, bismuth phosphide and lead phosphide. The coating material has an excellent wetting to the matrix of a metal plated with the coating material, can promote the formation of an alloy phase between the plating metal matrix and a plating layer, and can also form a plating layer having an improved solderability and an improved corrosion resistivity. The coating material may further contain 0.1-7.0 weight percent of zinc and/or 0.5-35.0 weight percent of antimony, the former imparting sacrificial anodicity to the plating layer, while the latter imparting an enhanced hardness to the plating layer.

REFERENCES:
patent: 320444 (1885-06-01), Randolph
patent: 650911 (1900-06-01), Rumely
patent: 1059982 (1913-04-01), Dwyer
patent: 2298237 (1942-10-01), Smith et al.
patent: 3793161 (1974-02-01), Manko

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