Hot chuck assembly for integrated circuit wafers

Details Hot chuck assembly for integrated circuit wafers Hot chuck assembly for integrated circuit wafers

1986-07-24

1989-10-10

Yuen, Henry C.

Heating

Heat applicator having structure for mounting it on or...

219460, 34145, 34 92, F24J 300

Patent

active

048728357

ABSTRACT:
A hot chuck assembly characterized by a platen suspended over a base assembly by four, equally spaced mounting assemblies. The suspension points on the platen are provided as close as possible to its upper, wafer support surface so that thermal expansion of the platen has a minimal effect on the position of a supported wafer. Each of the mounting post assemblies includes a pair of resilient leg portions which can flex in a radial direction to absorb radial expansion or contraction of the platen. In consequence, the hot chuck assembly of the present invention minimizes both lateral and axial displacement of a supported integrated circuit wafer as the platen heats and cools.

REFERENCES:
patent: 3064363 (1962-11-01), Ikeachi
patent: 3889389 (1975-06-01), Serup
patent: 4020563 (1977-05-01), Hoefer
patent: 4415788 (1983-11-01), Field
patent: 4518848 (1985-05-01), Weber
patent: 4549052 (1985-10-01), Simon
patent: 4556785 (1985-12-01), Blechschmid et al.

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