Hot alignment assembly method for optoelectronic packages

Details Hot alignment assembly method for optoelectronic packages Hot alignment assembly method for optoelectronic packages

1984-04-20

1987-03-17

Lee, John

350 9620, 357 80, G02B 636

Patent

active

046502858

ABSTRACT:
A method is provided for low cost assembly of semiconductive optoelectronic devices by hot aligning wide tolerance components. In the hot alignment step, electrical power is applied to the semiconductor to aid in an optical alignment operation.

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Stevenson, "An Approach to Low Cost Fiber Optics Components," Electro/82, Session 27, paper 2, May 1982, 6 pp.

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