Horizontal transfer test handler

Details Horizontal transfer test handler Horizontal transfer test handler

1997-11-06

2001-02-06

Metjahic, Safet (Department: 2858)

Electricity: measuring and testing

Measuring, testing, or sensing electricity, per se

With rotor

C324S1540PB, C324S754090, C414S403000

Reexamination Certificate

active

06184675

ABSTRACT:

FIELD OF THE INVENTION
This invention relates to a horizontal transfer test handler for transferring IC devices to and from a test head of an IC tester, and more particularly, to a horizontal transfer test handler that automatically recognizes types and positions of IC devices, existence of the IC devices, types of device trays, and the like, through a video data acquisition means.
BACKGROUND OF THE INVENTION
Test handlers are frequently used for testing IC devices in combination with IC testers for automatically transferring IC devices to and from test heads of the IC testers. Test handlers are classified into two types, a vertical transfer type in which IC devices are transferred from the higher positions to the lower positions by their own gravity, and a horizontal transfer type in which IC devices are transferred along the horizontal surface of the test handler. This invention is directed to the horizontal transfer type test handler.
In a horizontal transfer test handler, a plurality of IC devices to be tested are provided on a device tray and horizontally transferred to a test head of an IC tester. Various test signals are supplied to the IC devices at the test head, and the resultant output signals from the IC devices are evaluated by the IC tester. The tested IC devices are classified based on the test results and transferred to the corresponding device trays.
An example of horizontal transfer test handler in the conventional technology is shown in
FIGS. 6-8
. A horizontal transfer test handler is a robot mechanism that transfers IC devices in horizontal directions, places the IC devices on the test head of the IC tester, receives the IC devices that have been tested, and sorts the IC devices on the device trays on the basis of the test results.
As shown in
FIG. 6
, the horizontal transfer test handler
30
in the prior art is comprised of a device transfer mechanism
13
to pick, transfer, and place the IC devices, a mobile arm
12
to allow movements of the device transfer mechanism
13
in a Y direction, an X direction rail to allow movements of the mobile arm
12
in an X direction, a loader area
22
for loading a device tray
43
having a plurality of IC devices to be tested, an unloader area
23
for receiving the IC devices that have passed the test on a device tray
43
, sorter areas
24
and
25
for sorting the tested IC devices that have failed in the test on respective device trays
43
, a heater area
27
for applying heat to the IC devices to be tested so that the IC devices are tested under a high temperature environment, an empty tray area
26
for placing a device tray
43
emptied in the loader area
22
, and change kits
41
and
42
for accommodating different sizes and types of device trays and IC sockets.
As shown in
FIG. 7
, the device transfer mechanism
13
is comprised of a suction pad
16
that performs suction (pick operation) and suction release (place operation) processes for IC devices
10
stored on a device tray
43
. The suction force is created, for example, by a vacuum pressure. A suction arm
15
allows movements of the suction pad
16
in a Z (up-down) direction.
In
FIG. 6
, the horizontal transfer test handler
30
is connected to a test head
50
that is electrically connected to an IC tester
51
. The test head
50
has an IC socket
40
that acts as an interface between the IC device
10
under test and the test head
50
. The IC socket
40
mounted on the test head
50
transmits electric signals from each of its contact terminals to a corresponding device pin during the test of the IC device
10
.
The change kits are groups of mechanical parts for adjusting the test handler
30
to various types and sizes of IC devices and the device trays by replacing all or portions of the mechanical parts. The kind of the change kit includes a change kit
42
that supports the device tray
43
of different sizes and types. The device tray
43
is mounted on the loader area
22
while being adjusted its position by the change kit
42
. The change kit
41
performs an accurate mechanical positioning for the IC socket on the test head
50
. Thus, the change kit
41
adjusts the position of the IC socket
40
relative to the test head
50
in response to the size and types of the IC devices to be tested.
FIG. 8
is a schematic diagram showing a control section of the horizontal transfer test handler. The control section is comprised of an input/output means
61
for receiving a control program and input data and generating test information or other test results, a controller
62
that interprets and executes the control program and input data, a device transfer mechanism driver
63
controlled by the controller
62
. Based on the drive signals from the driver
63
, the device transfer mechanism
13
is moved in the X, Y, and Z directions. Namely, a pulse motor (not shown) is controlled to drive the suction arm
15
in the Z direction. The mobile arm
12
is driven in the X direction while the device transfer mechanism
13
is driven in the Y direction, respectively, by the drive signals from the driver
63
.
Referring back to
FIG. 6
, the horizontal transfer test handler
30
transfers the IC device
10
in a horizontal direction, and presses the lead pins of the IC device
10
to the contact terminals of the IC socket
40
mounted on the test head
50
. Test signals are applied to the IC device from the IC tester through the IC socket
40
. The resultant signals from the IC device
10
are transmitted to the IC tester through the IC socket
40
and evaluated by comparing the resultant signals with expected data. The IC tester determines pass or fail of the IC devices
10
. The horizontal transfer test handler
30
sorts the tested IC devices
10
according to the test results.
The IC devices
10
to be tested by such a system of the test handler and IC tester are IC, LSI circuits and VLSI circuits. Even when the functions are identical, IC devices are put in different type and size of packages to meet the needs in the market. For example, the kinds of packages include SOP (Small Outline Package), QFP (Quad Flat Package), BGA (Ball Grid Array Package), and so on. The number of pins of the IC devices to be connected to outside electrodes also extends to a wide range, such as from a few pins to several hundred pins. The distance between the two adjacent pins of the IC devices, i.e., a pin pitch, is very small, such as from 0.25 mm to 0.8 mm.
The device tray
43
stores IC devices
10
in its hole-like seats where each of the IC devices is positioned by tapered walls of the seat. For example, the device tray
43
shown in
FIG. 6
can store 24 (4×6=24) devices. The size of the device tray varies, for instance, from 100 mm to 140 mm in width, and from 206 mm to 330 mm in length.
The operation and function of the horizontal transfer test handler
30
is explained in the following.
Prior to the start of the test, the IC devices
10
to be tested are stored in the device tray
43
which is loaded on the loader area
22
of the test handler
30
. Test programs and necessary data for testing the IC devices
10
are installed in the test handler
30
through the input/output means
61
. The necessary data for the test includes the information on the kinds of IC devices
10
to be tested, the package types of the IC devices
10
, the number of device pins, and the size of the device tray
43
.
The suction arm
15
moves in the Z direction and the suction pad
16
performs the suction process on the IC devices
10
stored in the device tray
43
. While sucking the IC device
10
at the tip of the suction pad
16
, the mobile arm
12
and the device transfer mechanism
13
move in the X and Y directions to the heater area
27
to place the IC device
10
thereon so that the IC device is provided with heat. Then the IC device
10
heated in the heater area
27
is again picked up by the suction pad
16
and moved to the IC socket
40
on the test head
50
to connect the lead pins of the IC device
10
to the contact terminals of the IC s

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