Metal fusion bonding – Including means to apply flux or filler to work or applicator – By partial or total immersion of work or applicator into liquid
Patent
1997-07-31
1999-08-10
Ryan, Patrick
Metal fusion bonding
Including means to apply flux or filler to work or applicator
By partial or total immersion of work or applicator into liquid
228 201, 228 34, 228 36, 228 43, 228 495, 228259, 228260, B23K 108, B23K 100, B23K 3704
Patent
active
059345403
ABSTRACT:
A solder immersion chamber in a solder crater/leveler includes a solder manifold having upper and lower solder chambers, from which solder is directed onto the top and bottom surfaces of printed circuit boards conveyed therebetween. The solder immersion chamber has a pair of driven rollers at either end thereof for conveying the printed circuit boards through the solder immersion chamber, and for damming and holding the molten solder within the solder immersion chamber. A pair of oil weirs is provided adjacent either side of the upper solder chamber for continuously flowing oil to flood the top surface of the molten solder in the solder immersion chamber. A skimmer skims oil from the top surface of the molten solder, and returns the separated oil to the pair of oil weirs.
REFERENCES:
patent: 4530457 (1985-07-01), Down
patent: 4608941 (1986-09-01), Morrris
patent: 4903631 (1990-02-01), Morris
patent: 5007369 (1991-04-01), Morris
patent: 5209782 (1993-05-01), Morris
patent: 5226924 (1993-07-01), Meuche
Ryan Patrick
Stoner Kiley
Teledyne Industries Inc.
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