Horizontal package having die supports leads formed along lead c

Details Horizontal package having die supports leads formed along lead c Horizontal package having die supports leads formed along lead c

1998-04-13

1999-11-02

Hardy, David B.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

257666, H01L 23495

Patent

active

059776196

ABSTRACT:
Supporting leads extend from one side portion of a package to another side portion thereof and are arranged on both sides of an island such that both ends of the island are supported. An electrode for a fixing potential of a semiconductor chip is connected to these supporting leads by a bonding wire. One end of these supporting lead is located outside a column of an outer lead portion as the same structure as the outer lead portion. Thus, while a structure for commonly using each of the supporting leads as a lead for a fixing potential is adopted, a thermal distribution of the semiconductor chip can be uniformed and no island is inclined at a resin seal time.

REFERENCES:
patent: 5065224 (1991-11-01), Fraser et al.
patent: 5150194 (1992-09-01), Brooks et al.
patent: 5455200 (1995-10-01), Bigler et al.
patent: 5570046 (1996-10-01), Sharpe-Geisler
patent: 5592020 (1997-01-01), Nakao et al.
patent: 5907184 (1999-05-01), Corisis et al.

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