Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
2006-10-31
2006-10-31
Ta, Tho D. (Department: 2833)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
C439S161000, C439S907000, C439S908000
Reexamination Certificate
active
07128579
ABSTRACT:
Disclosed is a semiconductor package structure that incorporates the use of conductive pins to electrically and mechanically connect a semiconductor module and a substrate (e.g., printed wiring board). Specifically, one or both ends of the pins are hooked and are adapted to allow a press-fit connection with the walls of the plated through holes of either one or both of the semiconductor module and the substrate. The hook-shaped ends of the pins may have one or more hooks to establish the connection. Additionally, the pins may be formed of a temperature induced shape change material that bends to allow engaging and/or disengaging of the hook-shaped ends from the walls of the plated through holes.
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Brodsky William L.
Busby James A.
Chamberlin Bruce J.
Ferrill Mitchell G.
Susko Robin A.
Blecker, Esq. Ira D.
Gibb I.P. Law Firm LLC
International Business Machines - Corporation
Ta Tho D.
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