Homopolymerized epoxy-based form-in-place material

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Cellular products or processes of preparing a cellular...

Reexamination Certificate

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C521S097000, C521S135000, C521S178000

Reexamination Certificate

active

06890964

ABSTRACT:
A two-component foam-in-place structural material for producing a foamed product. The first component of the system includes an epoxy-based resin preferably formulated with a physical blowing agent particulate material. The physical blowing agent core is encapsulated within a shell or skin that will change state. The second component is an acid that is capable of initiating polymerization of the resin. A reactive mixture is achieved through the combination of the first and second components wherein heat from the exothermic reaction of the epoxy component caused by the acid in turn causes the thermoplastic shell having a solvent core to soften and increase in size due to gas pressure and change in state of the shell thereby foaming the reactive mixture.

REFERENCES:
patent: 4427481 (1984-01-01), Smith et al.
patent: 4538380 (1985-09-01), Colliander
patent: 4693775 (1987-09-01), Harrison et al.
patent: 4724243 (1988-02-01), Harrison
patent: 4749434 (1988-06-01), Harrison
patent: 4769166 (1988-09-01), Harrison
patent: 4922596 (1990-05-01), Wycech
patent: 4923902 (1990-05-01), Wycech
patent: 4978562 (1990-12-01), Wycech
patent: 5124186 (1992-06-01), Wycech
patent: 5648401 (1997-07-01), Czaplicki
patent: 5712317 (1998-01-01), Makhlouf et al.
patent: 5884960 (1999-03-01), Wycech
patent: 5932680 (1999-08-01), Heider
patent: 5948508 (1999-09-01), Pastore et al.
patent: 5964979 (1999-10-01), George et al.
patent: 5985435 (1999-11-01), Czaplicki et al.
patent: 5994422 (1999-11-01), Born et al.
patent: 6004425 (1999-12-01), Born et al.
patent: 6030701 (2000-02-01), Johnson et al.
patent: 6040350 (2000-03-01), Fukui
patent: 6057382 (2000-05-01), Karim et al.
patent: 6077884 (2000-06-01), Hess et al.
patent: 6096791 (2000-08-01), Born et al.
patent: 6136398 (2000-10-01), Willett et al.
patent: 6153302 (2000-11-01), Karim et al.
patent: 6174932 (2001-01-01), Pachl et al.
patent: 6218442 (2001-04-01), Hilborn et al.
patent: 6228449 (2001-05-01), Meyer
patent: 6263635 (2001-07-01), Czaplicki
patent: 6277898 (2001-08-01), Pachl et al.
patent: 6312668 (2001-11-01), Mitra et al.
patent: 6348513 (2002-02-01), Hilborn et al.
patent: 6350791 (2002-02-01), Feichtmeier et al.
patent: 6376564 (2002-04-01), Harrison
patent: 6444713 (2002-09-01), Pachl et al.
patent: WO 9902578 (1999-01-01), None
patent: WO 0157130 (2001-08-01), None
“The Epoxy Book”, A System Three Resins Publication, pp. 1-41, System Three Resins, Inc., Seattle, Washington.
“Epoxy Resins”, Second Edition Encyclopedia of Polymer Science and Engineering, vol. 6, pp. 322-382, 1985.
Copending U.S. Appl. No. 09/939,245 filed Aug. 24, 2001.
Copending U.S. Appl. No. 09/847,252 filed May 2, 2001.
Copending U.S. Appl. No. 09/858,939 filed May 16, 2001 (formerly U.S. Appl. No. 60/225,126).
Copending U.S. Appl. No. 09/502,686 filed Feb. 11, 2000.
Copending U.S. Appl. No. 09/459,756 filed Dec. 10, 1999.
Copending U.S. Appl. No. 09/676,335 filed Sep. 29, 2000.
Copending U.S. Appl. No. 09/676,443 filed Sep. 29, 2000.
Copending U.S. Appl. No. 09/676,725 filed Sep. 29, 2000.
Copending U.S. Appl. No. 09/524,961 filed Mar. 14, 2000.
Copending U.S. Appl. No. 09/923,138 filed Aug. 6, 2001.
Copending U.S. Appl. No. 60/324,495 filed Sep. 24, 2001.

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