Homogeneous thermoplastic semi-conductor chip carrier package

Details Homogeneous thermoplastic semi-conductor chip carrier package Homogeneous thermoplastic semi-conductor chip carrier package

1994-05-26

1995-11-28

Picard, Leo P.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

257704, 257706, H01L 2302

Patent

active

054710111

ABSTRACT:
A homogeneous thermoplastic semi-conductor chip carrier cavity package (HC package) which utilizes the same thermoplastic for various integral attachments to the HC package, such as, a molded lid and a circuit substrate. A chemical bonding or fusing of the integral attachments to the HC package provides increased protection from having moisture enter into the cavity of the HC package. The HC package eliminates problems which are associated with having different coefficients of thermal expansion for the HC package and its various integral attachments.

REFERENCES:
patent: 4507907 (1985-04-01), Wolfson
patent: 4545610 (1985-10-01), Lakritz et al.
patent: 4672506 (1987-06-01), Deguchi et al.
patent: 4700276 (1987-10-01), Freyman et al.
patent: 4700473 (1987-10-01), Freyman et al.
patent: 4868349 (1989-09-01), Chia
patent: 4890152 (1989-12-01), Hirata et al.
patent: 4940181 (1990-07-01), Juskey, Jr. et al.
patent: 5006673 (1991-04-01), Freyman et al.
patent: 5011066 (1991-04-01), Thompson
patent: 5024372 (1991-06-01), Altman et al.
patent: 5027191 (1991-06-01), Bourdelaise et al.
patent: 5120473 (1992-06-01), Kondo et al.
patent: 5128746 (1992-07-01), Pennisi et al.
patent: 5136365 (1992-08-01), Pennisi et al.
patent: 5136366 (1992-08-01), Worp et al.
patent: 5152057 (1992-10-01), Murphy
patent: 5153385 (1992-10-01), Juskey et al.
patent: 5241133 (1993-08-01), Mullen, III et al.
patent: 5278446 (1994-01-01), Nagaraj et al.
patent: 5293301 (1994-03-01), Tanaka et al.
patent: 5299092 (1994-03-01), Yaguchi et al.
patent: 5311402 (1994-05-01), Kobayashi et al.
patent: 5317196 (1994-05-01), Wong

Affiliated with

Also associated with

Rating

Homogeneous thermoplastic semi-conductor chip carrier package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Homogeneous thermoplastic semi-conductor chip carrier package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Homogeneous thermoplastic semi-conductor chip carrier package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2014926