Homogeneous quench substrate

Details Homogeneous quench substrate Homogeneous quench substrate

1995-04-24

1996-10-15

Lavinder, Jack W.

Metal founding

Process

Shaping liquid metal against a forming surface

164423, 164429, B22D 1106

Patent

active

055644902

ABSTRACT:
A quench substrate for rapid solidification of molten alloy into strip has a microcrystalline or amorphous structure. The substrate is composed of a thermally conducting alloy and the structure is substantially homogeneous. The substrate is a thermal conducting material such as copper or a copper alloy, and has a constituent grain size uniformity greater than 1 .mu.m and less than 1,000 .mu.m in size.

REFERENCES:
patent: 4190095 (1980-02-01), Bedell
patent: 4202404 (1980-05-01), Carlson
patent: 4307771 (1981-12-01), Draizen et al.
patent: 4475583 (1984-10-01), Ames
patent: 4479528 (1984-10-01), Maringer

Affiliated with

Also associated with

Rating

Homogeneous quench substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Homogeneous quench substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Homogeneous quench substrate will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1239010