Homogeneous low melting point copper based alloys

Details Homogeneous low melting point copper based alloys Homogeneous low melting point copper based alloys

1983-04-26

1984-12-18

Rutledge, L. Dewayne

Stock material or miscellaneous articles

All metal or with adjacent metals

Foil or filament smaller than 6 mils

164463, 148403, 22826318, 420472, 420473, 420485, 420587, 420457, C22C 906, B22D 1502

Patent

active

044891369

ABSTRACT:
A copper based low melting point metal alloy composition consists essentially of about 5 to 52 atom percent nickel, about 2 to 10 atom percent tin, about 10 to 15 atom percent phosphorus and the balance essentially copper and incidental impurities. The composition is such that the total of copper, nickel and tin ranges from about 85 to 90 atom percent.

REFERENCES:
patent: Re30854 (1982-01-01), Plewes et al.
patent: Re31180 (1983-03-01), Plewes
patent: 1535542 (1925-04-01), Price
patent: 2117106 (1938-05-01), Silliman
patent: 2235634 (1941-03-01), Hensel et al.
patent: 2269581 (1942-01-01), Crampton
patent: 3392017 (1968-07-01), Quaas et al.
patent: 3856513 (1974-12-01), Chen
patent: 4006838 (1977-02-01), Baumann et al.
patent: 4009027 (1977-02-01), Naodich et al.
patent: 4071358 (1978-01-01), Kawakatsu
patent: 4130421 (1978-12-01), Plewes et al.
patent: 4209570 (1980-06-01), DeCristofaro et al.
patent: 4253870 (1981-03-01), DeCristofaro et al.
patent: 4388270 (1983-06-01), Stavish et al.

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