Homogeneous low melting point copper based alloys

Details Homogeneous low melting point copper based alloys Homogeneous low melting point copper based alloys

1984-08-27

1986-03-04

Ramsey, Kenneth J.

Metal fusion bonding

Process

Critical work component, temperature, or pressure

22826311, B23K 3530

Patent

active

045736308

ABSTRACT:
A copper based low melting point metal alloy composition consists essentially of about 5 to 52 atom percent nickel, about 2 to 10 atom percent tin, about 10 to 15 atom percent phosphorus and the balance essentially copper and incidental impurities. The composition is such that the total of copper, nickel and tin ranges from about 85 to 90 atom percent.

REFERENCES:
patent: 2117106 (1938-05-01), Silliman
patent: 2235634 (1941-03-01), Hensel et al.
patent: 3392017 (1968-07-01), Quaas et al.
patent: 3524774 (1970-08-01), Volker et al.
patent: 3856513 (1974-12-01), Chen et al.
patent: 4006838 (1977-02-01), Baumann et al.
patent: 4209570 (1980-06-01), DeCristofaro et al.
patent: 4253870 (1981-03-01), DeCristofaro et al.
patent: 4497429 (1985-02-01), Bose et al.

Affiliated with

Also associated with

Rating

Homogeneous low melting point copper based alloys does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Homogeneous low melting point copper based alloys, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Homogeneous low melting point copper based alloys will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1590850