Homogeneous low melting point copper based alloys

Details Homogeneous low melting point copper based alloys Homogeneous low melting point copper based alloys

1983-04-26

1984-05-15

Rutledge, L. Dewayne

Stock material or miscellaneous articles

All metal or with adjacent metals

Foil or filament smaller than 6 mils

420473, 420485, 164463, 148403, 22826318, C22C 900, B23K 3530

Patent

active

044488521

ABSTRACT:
A copper based low melting point metal alloy composition consists essentially of about 2.5 to 11 atom percent tin, about 0 to 12 atom percent nickel and about 11 to 15 atom percent boron, the balance being essentially copper and incidental impurities. The composition is such that the total of copper and tin ranges from about 85 to 89 atom percent.

REFERENCES:
patent: Re30854 (1982-01-01), Plewes et al.
patent: Re31180 (1983-03-01), Plewes
patent: 2117106 (1938-05-01), Silliman
patent: 2755182 (1956-07-01), Cape
patent: 2946678 (1960-07-01), Rou
patent: 4009027 (1977-02-01), Naidich et al.
patent: 4071358 (1978-01-01), Kawakatsu
patent: 4209570 (1980-06-01), DeCristofaro et al.
patent: 4388270 (1983-06-01), Stavish et al.

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