Homogeneous low melting point copper based alloys

Details Homogeneous low melting point copper based alloys Homogeneous low melting point copper based alloys

1982-09-20

1984-05-15

Rutledge, L. Dewayne

Stock material or miscellaneous articles

All metal or with adjacent metals

Foil or filament smaller than 6 mils

420470, 148403, 164463, 22826318, C22C 900, B23K 3530

Patent

active

044488513

ABSTRACT:
A copper based low melting point metal alloy composition consists essentially of about 2.5 to 11 atom percent tin and about 11 to 15 atom percent boron, the balance being essentially copper and incidental impurities. The composition is such that the total of copper and tin ranges from about 85 to 89 atom percent.

REFERENCES:
patent: Re30854 (1982-01-01), Plewes et al.
patent: Re31180 (1983-03-01), Plewes
patent: 2117106 (1938-05-01), Silliman
patent: 2755182 (1956-07-01), Cape
patent: 2768893 (1956-10-01), Bredzs
patent: 2946678 (1960-07-01), Rov
patent: 4009027 (1977-02-01), Naidich et al.
patent: 4071358 (1978-01-01), Kawakatsu
patent: 4209570 (1980-06-01), DeCristofuro et al.
patent: 4388270 (1983-06-01), Stavish et al.

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