Homogeneous electroviscous fluids using aluminum compounds

Details Homogeneous electroviscous fluids using aluminum compounds Homogeneous electroviscous fluids using aluminum compounds

1996-06-11

1998-09-01

Skane, Christine

Compositions

Heat-exchange, low-freezing or pour point, or high boiling...

Organic components

252 73, 252579, 508506, 508539, C10M12928, C10M12964, C10M17100

Patent

active

058007318

ABSTRACT:
Homogeneous, electro-viscous fluids are provided which contain aluminum soaps based on products obtained by reacting one or more mono- or polycarboxylic acid(s) or the anhydrides or semi-esters thereof with reactive aluminum compounds, such as aluminum alcoholates. The aforesaid fluids manifest high electro-rheological effect and are completely homogeneous, and do not require a dispersant.

REFERENCES:
patent: 2396744 (1946-03-01), Morway
patent: 2528373 (1950-10-01), Knowles et al.
patent: 2699428 (1955-01-01), Lux et al.
patent: 2851417 (1958-09-01), Andress, Jr.
patent: 2932659 (1960-04-01), Orthner et al.
patent: 3017361 (1962-01-01), Morris et al.
patent: 3047507 (1962-07-01), Winslow
patent: 3271310 (1966-09-01), LeSuer
patent: 3413222 (1968-11-01), Hotten
patent: 3632509 (1972-01-01), Inami et al.
patent: 3684566 (1972-08-01), Josten et al.
patent: 3791972 (1974-02-01), Myers
patent: 3939082 (1976-02-01), Williams et al.
patent: 4225447 (1980-09-01), Law et al.
patent: 4714567 (1987-12-01), Roha
patent: 4886610 (1989-12-01), Wirth et al.
patent: 5125555 (1992-06-01), Grisoni et al.
patent: 5266229 (1993-11-01), Tomizawa et al.

Affiliated with

Also associated with

Rating

Homogeneous electroviscous fluids using aluminum compounds does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Homogeneous electroviscous fluids using aluminum compounds, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Homogeneous electroviscous fluids using aluminum compounds will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-266718