Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent
1994-11-14
1998-10-27
Ledynh, Bot L.
Electricity: conductors and insulators
Boxes and housings
Hermetic sealed envelope type
257704, 257706, 257707, 257787, 257788, 174 522, 361709, 361714, 361718, H01L 2302
Patent
active
058279997
ABSTRACT:
A thermoplastic chip carrier cavity package for one or more semi-conductor integrated circuit chips. A circuit substrate is formed of a suitable thermoplastic such as PPS or LCP. A casing is further formed atop the substrate with the casing being made of the suitable thermoplastic and being chemically fused to a portion of the circuit substrate to create a moisture seal therebetween. An encapsulant for filling the cavity within the casing and a lid may also be utilized to further secure and seal the chip mounted therein from moisture.
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Maslakow William H.
McMillan John R.
Amkor Electronics, Inc.
Ledynh Bot L.
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