Holographic transfer lamination materials and process

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

156106, 156235, 156240, 156241, 156249, 1562755, 156334, B32B 3100

Patent

active

053605012

ABSTRACT:
Disclosed is a process for configuring a hologram (30) onto a final laminate (38) incorporating the hologram (30), including a car windshield or an aircraft canopy. The process includes first developing the hologram (30) on a process substrate (22). Intermediate the hologram (30) and the process substrate (22) is a thermoplastic layer (24). After the hologram (30) has been developed, the hologram laminate (20) including the process substrate (22), thermoplastic layer (24), and hologram (30) is applied to a first final laminate layer (34) by means of an adhesive (32) such that the hologram (30) is facing the first final laminate layer (34). Once this step is completed heat is applied to the hologram laminate (20) to melt the thermoplastic layer (24), thus removing the process substrate (22). Therefore, a second final laminate layer (40) can be applied to the opposite side of the hologram (30) without any drawbacks from the thickness of any additional support layers in the final laminate (38).

REFERENCES:
patent: 3208902 (1965-09-01), Arond et al.
patent: 3967021 (1976-06-01), Weingrad
patent: 4249958 (1981-02-01), Baudin et al.
patent: 4367108 (1983-01-01), Valimont
patent: 4597815 (1986-07-01), Nakamura
patent: 4717739 (1988-01-01), Chevreux et al.
patent: 4721648 (1988-01-01), Kleine-Doepke
patent: 4840757 (1989-06-01), Blenkhorn
patent: 4842389 (1989-06-01), Wood et al.
patent: 4856857 (1989-08-01), Takeuchi et al.
patent: 4908285 (1990-03-01), Kushibiki et al.
patent: 4963471 (1990-10-01), Trout et al.
patent: 4976799 (1990-12-01), Wood
patent: 4978593 (1990-12-01), Yin et al.
patent: 5066525 (1991-11-01), Nakamachi et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Holographic transfer lamination materials and process does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Holographic transfer lamination materials and process, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Holographic transfer lamination materials and process will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1800334

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.