Electricity: conductors and insulators – Feedthrough or bushing – Compression
Patent
1989-06-15
1991-07-23
Jackson, Jr., Jerome
Electricity: conductors and insulators
Feedthrough or bushing
Compression
174 521, 357 80, H01L 2328, H01L 3902
Patent
active
050348000
ABSTRACT:
A hollow-type package of optically and non-optically active semiconductor devices is entirely made of moldable plastic material by utilizing a preformed box-like shell of a rigid plastic material for enclosing the semiconductor dye and the electrical connection wires before molding the shell in an epoxy resin. The protective shell is composed of two corresponding half parts and, in the case of optically active devices, the top half of the shell is provided with a window closed by a transparent pane which is sealed during the encapsulation. Preferably, the two halves of the protection shell have two spaced lateral walls forming two spaced sealing perimeters and a perimetral chamber which is formed therebetween and surrounds a central cavity of the shell for accommodating any encapsulating resin which may eventually enter through the outer sealing perimeter during molding. The central cavity of the shell may be filled with a nonrigid silicon resin before molding for further increasing the protection. The entirely plastic hollow package may be formed through a normal plastic molding process.
REFERENCES:
patent: 3665256 (1972-05-01), Goun et al.
patent: 3778685 (1973-12-01), Kennedy
patent: 4012579 (1977-03-01), Fox et al.
patent: 4644384 (1987-02-01), Charoensakvirochana et al.
patent: 4663833 (1987-05-01), Tanaka et al.
patent: 4722060 (1988-01-01), Quinn et al.
patent: 4855868 (1989-08-01), Harding
Patent Abstracts of Japan, vol. 10, No. 209, Jul. 22, 1986, 61-048944 (Matsushita Electronics).
Patent Abstracts of Japan, vol. 12, No. 221, 63-015448 (Nitto Electric).
Patent Abstracts of Japan, vol. 9, No. 298, 60-136347 (Hitachi Maikuro Computer Engineering).
Patent Abstracts of Japan, vol. 6, No. 155, 57-076867 (Nippon Denki).
Jackson, Jr. Jerome
Monin Donald L.
SGS--Thomson Microelectronics S.r.l.
LandOfFree
Hollow plastic package for semiconductor devices does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Hollow plastic package for semiconductor devices, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Hollow plastic package for semiconductor devices will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-436521