Plastic and nonmetallic article shaping or treating: processes – Direct application of fluid pressure differential to... – With internal application of fluid pressure
Patent
1992-08-13
1995-03-07
Timm, Catherine
Plastic and nonmetallic article shaping or treating: processes
Direct application of fluid pressure differential to...
With internal application of fluid pressure
425130, B29C 4517
Patent
active
053955820
ABSTRACT:
An apparatus and method are provided for producing a hollow molded product having a thick part free from a thin part or defect. According to the method, a mold is designed to have a cavity for a hollow molded product having a bent portion such as an assist grip. This mold is provided with dams mounted in a gas passage around an in-course in the bent forming portion. When injecting fluid into the already injected resin in the cavity, the dams are so designed to function in guiding the resin to flow between the dam and an out-course of the cavity. By this method, sufficient amount of the resin remains around the in-course so as to form a thick part of the hollow molded product.
REFERENCES:
patent: 4101617 (1978-07-01), Friedrich
patent: 4136220 (1979-01-01), Olabisi
patent: 4923666 (1990-05-01), Yamazaki et al.
patent: 5162230 (1992-11-01), Ziegler et al.
patent: 5254306 (1993-01-01), Inada et al.
patent: 5262103 (1993-11-01), Komiyama et al.
Shah et al., Gas Injection Molding of Thermoplastic Composite Window Guidance Channel, Internation Congress and Exposition SAE International, Mar. 1, 1991.
Webster's Ninth New Collegiate Dictionary, 1986, p. 323.
Shigeno Kazumichi
Yabuya Shigeru
Timm Catherine
Toyoda Gosei Co,., Ltd.
LandOfFree
Hollow injection molding method does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Hollow injection molding method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Hollow injection molding method will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1404468