Hole filling using an etched hole-fill stand-off

Details Hole filling using an etched hole-fill stand-off Hole filling using an etched hole-fill stand-off

2005-07-26

2005-07-26

Ortiz, Angela (Department: 1732)

Plastic and nonmetallic article shaping or treating: processes

Forming electrical articles by shaping electroconductive...

Conductive carbon containing

C264S139000, C264S267000, C264S273000, C427S097700, C427S282000

Reexamination Certificate

active

06921505

ABSTRACT:
An assembly is disclosed that includes an etched hole-fill standoff; a tooling plate contacting the etched hole-fill stand-off, the stand-off and tooling plate being aligned to each other; a device having holes to be filled removably contacting the stand-off, the stand-off and device being aligned to each other; the device and the stand-off each having at least one hole, the hole of the device being aligned with the hole of the stand-off. An assembly is also disclosed comprising an etched hole-fill standoff, the stand-off comprising an etched layer bonded to a non-etched layer. A method of filling holes in a substrate having a plurality of holes to be filled includes the steps of providing an etched hole-fill stand-off, aligning the stand-off to a tooling plate, aligning the substrate to the stand off and placing the substrate in contact with the stand-off, and filling the plurality of holes of the substrate.

REFERENCES:
patent: 3601523 (1971-08-01), Arndt
patent: 4106187 (1978-08-01), Smith et al.
patent: 4283243 (1981-08-01), Andreades et al.
patent: 4360570 (1982-11-01), Andreades et al.
patent: 4445952 (1984-05-01), Reynolds et al.
patent: 4622239 (1986-11-01), Schoenthaler et al.
patent: 4700474 (1987-10-01), Choinski
patent: 4777721 (1988-10-01), Choinski
patent: 4783247 (1988-11-01), Seibel
patent: 4884337 (1989-12-01), Choinski
patent: 4945313 (1990-07-01), Brilka et al.
patent: 4964948 (1990-10-01), Reed
patent: 4995941 (1991-02-01), Nelson et al.
patent: 5053921 (1991-10-01), Nelson et al.
patent: 5058265 (1991-10-01), Goldfarb
patent: 5117069 (1992-05-01), Higgins
patent: 5133120 (1992-07-01), Kawakami et al.
patent: 5145691 (1992-09-01), Kawakami et al.
patent: 5220723 (1993-06-01), Okada
patent: 5274916 (1994-01-01), Kawabata et al.
patent: 5277854 (1994-01-01), Hunt
patent: 5332439 (1994-07-01), Watanabe et al.
patent: 5451721 (1995-09-01), Tsukada et al.
patent: 5456004 (1995-10-01), Swamy
patent: 5471091 (1995-11-01), Pasch et al.
patent: 5532516 (1996-07-01), Pasch et al.
patent: 5540779 (1996-07-01), Andris et al.
patent: 5578151 (1996-11-01), Andris et al.
patent: 5591353 (1997-01-01), Davignon et al.
patent: 5610103 (1997-03-01), Xu et al.
patent: 5637834 (1997-06-01), La Bate et al.
patent: 5662987 (1997-09-01), Mizumoto et al.
patent: 5699613 (1997-12-01), Chong et al.
patent: 5707575 (1998-01-01), Litt et al.
patent: 5744171 (1998-04-01), Schneider
patent: 5744285 (1998-04-01), Felten et al.
patent: 5753976 (1998-05-01), Harvey
patent: 5761803 (1998-06-01), St. John et al.
patent: 5766670 (1998-06-01), Arldt et al.
patent: 5822856 (1998-10-01), Bhatt et al.
patent: 5824155 (1998-10-01), Ha et al.
patent: 5851344 (1998-12-01), Xu et al.
patent: 5906042 (1999-05-01), Lan et al.
patent: 5925414 (1999-07-01), Buechele et al.
patent: 5994779 (1999-11-01), Gardner et al.
patent: 6000129 (1999-12-01), Bhatt et al.
patent: 6009620 (2000-01-01), Bhatt et al.
patent: 6015520 (2000-01-01), Appelt et al.
patent: 6079100 (2000-06-01), Farquhar et al.
patent: 6090474 (2000-07-01), Johansson et al.
patent: 6106891 (2000-08-01), Kulesza et al.
patent: 6138350 (2000-10-01), Bhatt et al.
patent: 6149857 (2000-11-01), McArdle et al.
patent: 6153508 (2000-11-01), Harvey
patent: 6184133 (2001-02-01), Iijima et al.
patent: 6261501 (2001-07-01), Miyagawa et al.
patent: 6276055 (2001-08-01), Bryan et al.
patent: 6281448 (2001-08-01), Tsukamoto
patent: 6282782 (2001-09-01), Biunno et al.
patent: 6659328 (2003-12-01), Dances
patent: 0 194 247 (1986-09-01), None
patent: 0194247 (1986-09-01), None
patent: 0 713 358 (1996-05-01), None
patent: 0713358 (1996-05-01), None
patent: 0 723 388 (1996-07-01), None
patent: 0723388 (1996-07-01), None
patent: 2 684 836 (1991-12-01), None
patent: 2684836 (1993-06-01), None
patent: 2714567 (1995-06-01), None
patent: 2 714 567 (1995-06-01), None
patent: 2 120 017 (1983-11-01), None
patent: 2120017 (1983-11-01), None
patent: 2246912 (1992-02-01), None
patent: 2 246 912 (1992-02-01), None
patent: 2 341 347 (2000-03-01), None
patent: 2341347 (2000-03-01), None
patent: 53-104857 (1978-09-01), None
patent: 54139065 (1979-10-01), None
patent: 54-139065 (1979-10-01), None
patent: 8011172 (1983-01-01), None
patent: 58011172 (1983-01-01), None
patent: 62-277794 (1987-12-01), None
patent: 62277794 (1987-12-01), None
patent: 62287696 (1987-12-01), None
patent: 62-287696 (1987-12-01), None
patent: 1173696 (1989-07-01), None
patent: 1236694 (1989-09-01), None
patent: 03004595 (1991-01-01), None
patent: 3004595 (1991-01-01), None
patent: 4186792 (1992-07-01), None
patent: 04186792 (1992-07-01), None
patent: 04239193 (1992-08-01), None
patent: 4239193 (1992-08-01), None
patent: 5275819 (1993-10-01), None
patent: 05275819 (1993-10-01), None
patent: 5310487 (1993-11-01), None
patent: 7176871 (1995-07-01), None
patent: 07176871 (1995-07-01), None
patent: 8172265 (1996-07-01), None
patent: 08172265 (1996-07-01), None
patent: 08191184 (1996-07-01), None
patent: 8191184 (1996-07-01), None
patent: 9083135 (1997-03-01), None
patent: 09083135 (1997-03-01), None
patent: 09321399 (1997-12-01), None
patent: 9321399 (1997-12-01), None
patent: 10065339 (1998-03-01), None
patent: 10256687 (1998-09-01), None
patent: 11054909 (1999-02-01), None
patent: WO 86/06243 (1986-10-01), None
patent: WO8606243 (1986-10-01), None
patent: WO0013474 (2000-03-01), None
patent: WO 00/13474 (2001-08-01), None
Via Etching Process, Feb. 1972.
Multilayer Printed Circuit Board Connections, Apr. 1996.
Process for Forming Copper Clad Vias, Aug. 1989.
Via Etching Process, Feb. 1972.
Multilayer printed Circuit Board Connections, Apr. 1996.
Process for Forming Copper Clad Vias, Aug. 1989.

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